31results about How to "Distributed capacitance increases" patented technology

The position of an object, which may be a user's finger, along a body is sensed capacitively. A measurement circuit meters the simultaneous injection of electrical charge into the two ends of the body, which may be shaped as a straight line or as a curve. A computing device computes the ratio of the relative changes in the amount of charge injected into each end of the element. The result of this computation is a one dimensional coordinate number plus a detection state indication, both of which can be fed to another functional element, such as an appliance controller, which interprets the coordinate and detection state as a command or measurement.

The invention relates to an implanted electrode compatible with MRI. The implanted electrode comprises a flexible insulated conduit, at least one contact, at least one connector and a spiral wire, wherein the flexible insulated conduit is provided with a first end and a second end opposite to the first end, the contacts are arranged on the outer surface of the first end of the flexible insulated conduit, the connectors are arranged on the outer surface of the second end of the flexible insulated conduit, the spiral wire is located in a cavity of the insulated conduit, or located in the wall of the insulated conduit or wound outside the conduit, and the contacts and the connectors are electrically connected through the spiral wire. The spiral diameter of at least one part of the spiral wire is larger than that of the other part of the spiral wire, so that the spiral wire is of a variable spiral diameter structure. The structure can change the electrical parameter performance, under an RF magnetic field of MRI, of the wire, and therefore the heating risk, caused by the RF magnetic field, on the contacts is reduced. The invention further relates to a manufacturing method for the implanted electrode compatible with MRI.

A method and apparatus is provided to reduce the spreading inductance and increase the distributed capacitance of power planes within the power distribution system of a semiconductor package substrate. In one embodiment, pre-fabricated copper-clad laminate (CCL) structures are utilized as starting material for the power plane pairs, which are then integrated into a package substrate using imaging, lamination, and drilling/plating processes. In alternate embodiments, a starting material having a larger insulating layer thickness may be used to form the CCL structure, whereby a pair of metallic planes having a perforated mesh pattern are adjoined through a dielectric layer to create an effective separation distance between the metallic planes. Alternate embodiments employ plating or deposition methods to obtain a minimum separation distance between the metallic planes of a power plane pair.

The invention relates to a concomitant impedance protection method for a half-wavelength transmission line. The method comprises the following steps of obtaining three-phase currents and three-phase voltages of the location of a relay protection device at an M side of the half-wavelength transmission line and the location of a relay protection device at an N side of the half-wavelength transmission line separately; judging whether the starting quantities of the M side and the N side meet the starting conditions or not; determining a fault point F according to a time difference that the starting quantities of the M side and the N side meet the starting conditions; and opening the relay protection action of the half-wavelength transmission line according to a concomitant impedance of the half-wavelength transmission line. The method provided by the invention can position the fault by a time-difference method according to the characteristics of a failure period, construct the concomitant impedance by compensating the voltages and the currents at two sides of the line, and correctly reflect an internal fault and an external fault of a line region. Two-terminal electric information is effectively utilized by the concomitant impedance protection, so that the protection can quickly and reliably act after the internal fault of the line region happens; the protection does not move by mistake after the external fault of the line region happens; and the protection has relatively high sensitivity.

The invention relates to a rotary transformer with relatively small output common ground error, which is composed of a stator and a rotor and exists in two structural forms, namely, segmental type andintegral type. The stator comprises a stator case, a stator iron core and a stator winding wound thereon, and the rotor comprises a rotor shaft sleeve, a rotor iron core and a rotor winding wound the reon, wherein two phase windings of the rotor winding and/or stator winding are all formed by the alternate arrangement of a circular coil assembly and a concentric coil assembly; and the circular coil assembly and the concentric coil assembly under the two poles of the two phase windings are both symmetrically arranged. The capacitance of the rotary transformer is greatly reduced due to the alternative distribution of the output windings, and the output common ground quadrature error and null voltage are also greatly reduced, thus lowering the system angle measurement error, improving the system precision, and simultaneously widening the excitation frequency application range of the rotary transformer, satisfying the application requirements of certain special systems on high excitation frequency and small output common ground error of the rotary transformer.

An improved low cost and highly consistent inductive apparatus. In one embodiment, the low cost and highly consistent inductive apparatus addresses concerns with so called conductive anodic filament (CAF) that occurs within these laminate structures. These conditions include high humidity, high bias voltage (i.e. a large voltage differential), high-moisture content, surface and resin ionic impurities, glass to resin bond weakness and exposure to high assembly temperatures that can occur, for example, during lead free solder bonding application. In a variant, mixed mode coupling techniques are utilized in order to extend the underlying operating bandwidth of the substrate inductive device. Methods of manufacturing and using the aforementioned substrate inductive devices are also disclosed.

A large-bandwidth and small-size periodic unit frequency selective surface structure comprises a first base material and a second base material. An upper conducting layer is arranged on the front face of the first base material, a middle conducting layer is arranged between the first base material and the second base material, a lower conducting layer is arranged on the back face of the second base material, and the upper conducting layer, the middle conducting layer and the lower conducting layer are formed by periodically arranging upper periodic units, middle periodic units and lower periodic units respectively, each upper periodic unit is formed by a broken line on the left side and an upper-layer first conducting metal sheet and an upper-layer second conducting metal sheet, wherein the upper-layer first conducting metal sheets and the upper-layer second conducting metal sheets are located on the right side. The middle periodic units are formed by middle-layer conducting metal sheets, each lower periodic unit is formed by a series of lower-layer parallel conducting metal wires, the periodic units on all layers are the same in size and are arranged vertically in an overlapped mode, and the edges of the periodic units are aligned. According to the large-bandwidth and small-size periodic unit frequency selective surface structure, face-to-face coupling of the conducting metal sheets is used, distributed capacitance is enhanced, and the relative size is reduced; the broken lines enhance the distributed capacitance and increase the relative passband bandwidth; the lower-layer parallel conducting metal wires enhance the frequency selective surface cross polarization isolation.

The invention relates to an antenna, which comprises a first dielectric substrate, a first metal sheet and a second metal sheet. The first and second metal sheets are attached to the two opposite surfaces of the first dielectric substrate. A first feeder line is arranged in a way of enclosing the first metal sheet. A second feeder line is arranged in a way of enclosing the second metal sheet. The first and second feeder lines feed signals in the first and second metal sheets in a coupling way respectively. A first micro-channel structure is hollowed in the first metal sheet to form first metal wiring on the first metal sheet. A second micro-channel structure is hollowed in the second metal sheet to form second metal wiring on the second metal sheet. The first and second feeder lines are electrically connected. A second dielectric substrate also covers the first metal sheet. According to the antenna, the metal sheets are arranged on the two surfaces of the first dielectric substrate, so that the area of the antenna is fully utilized, the antenna can work at low working frequency in such an environment, and the requirements of miniaturization, low working frequency and broadband multimode for the antenna are met. In addition, the invention also relates to a multiple input multiple output (MIMO) antenna with a plurality of antennae.

The invention discloses an antenna housing based on a wide-stop-band low-frequency multilayer frequency selective surface. An upper conductive layer is arranged on the upper surface of an upper-layerPCB; a middle conductive layer is arranged on the lower surface of the upper-layer PCB; a lower conductive layer is arranged on the lower surface of a lower-layer PCB; the upper conductive layer is composed of a plurality of upper interdigital structure units which are periodically arranged, the middle conductive layer is composed of a plurality of cross-shaped structure units which are periodically arranged, the lower conductive layer is composed of a plurality of lower interdigital structure units which are periodically arranged, and each upper interdigital structure unit corresponds to onecross-shaped structure unit and one lower interdigital structure unit; each of the upper interdigital structure unit and the lower interdigital structure unit is composed of two comb tooth structures,the lengths of outermost teeth of the two comb tooth structures are the same, the outermost teeth are oppositely distributed, and a gap is formed between the outermost teeth of the two comb tooth structures; each upper interdigital structure unit is completely aligned with the corresponding cross-shaped structure unit and the corresponding lower interdigital structure unit; and the antenna housing has relatively low resonant frequency.

A distributed inductance and capacitance parameter integrated filter comprises an inner magnetic core and an outer magnetic core which are magnetically conductive, conductive and grounded. One end ofthe inner magnetic core is connected with the outer magnetic core through threads, and the other end of the inner magnetic core is covered with an end cover which is magnetically conductive. The innermagnetic core, the outer magnetic core and the end cover are fixed through screws to form a closed magnetic circuit and an electromagnetic shielding shell. A surface-insulated filter wire penetratesthrough one end of the outer magnetic core and is tightly wound on the inner magnetic core, and grounded wires are wound between turns of the filter wire in parallel to form turn-to-turn isolation wires, so that turn-to-turn capacitive coupling is prevented. And the filtering wire penetrates out of the end cover at the other end. When a multi-layer winding method is adopted, a grounded interlayerisolation metal layer is additionally arranged between layers. According to the invention, the inductance-capacitance formed by the distribution parameters is fully utilized. The adverse effect of distributed capacitance parameters in an original independent inductor on the inductor is overcome; the adverse effect of the distributed inductance parameters in the independent capacitor device on thecapacitor is avoided. The adverse parameters are changed into favorable parameters, the high-frequency performance of the filter is improved, the order of the filter can be reduced, the structure of the filter is simplified, the size of the filter is reduced, and the cost is reduced.

The invention discloses a filter and communication equipment. According to the filter, the structure that a traditional tuning screw extends into a resonance column is improved; the middle part of thetuning screw is hollowed out to form a hollow part, the resonance column protrudes to form a protruding part matched with the hollow part, and the upper end of the protruding part extends into the hollow part, so that the induction area of the tuning screw and the resonance column is increased, equivalently, the distributed capacitance of the resonator is increased, in addition, the size of the filter is effectively reduced, and the cost is reduced.

The invention discloses an antenna which comprises a first dielectric substrate and a second dielectric substrate, wherein a metal sheet and a feeder that surrounds the metal sheet and is fed in the metal sheet in a coupled mode are arranged on the first dielectric substrate; the first dielectric substrate is covered with the second dielectric substrate; and at least one first microgroove structure and one second microgroove structure that are unsymmetrical are hollowed on the metal sheet to allow the antenna to have at least two different resonance frequency bands. According to the antenna, the first dielectric substrate is covered with the second dielectric substrate, so that the miniaturization and the high performance of the antenna can be ensured when the antenna works at a low frequency; the two unsymmetrical microgroove structures are arranged on the metal sheet, so that the antenna at least has two resonance frequency bands; and multiple modes can be achieved easily. In addition, the invention further discloses an MIMO (multiple input multiple output) antenna provided with the antennas, and the MIMO antenna has high isolation.