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Method and apparatus for extending the bandwidth of a transformer with mixed-mode coupling

A transformer and connector module technology, applied in the direction of transformer/inductor core, inductor/transformer/magnet manufacturing, transformer/inductor coil/winding/connection, etc.

Inactive Publication Date: 2017-06-09
PULSE ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Furthermore, since the two aforementioned components that make up the impedance of the transformer are of the "distributed" type, they cannot be easily compensated by adding external components, such as by adding discrete capacitors and / or inductors

Method used

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  • Method and apparatus for extending the bandwidth of a transformer with mixed-mode coupling
  • Method and apparatus for extending the bandwidth of a transformer with mixed-mode coupling
  • Method and apparatus for extending the bandwidth of a transformer with mixed-mode coupling

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Embodiment Construction

[0030] As used herein, the terms "electrical component" and "electronic component" are used interchangeably and refer to a component adapted to provide some electrical and / or signal conditioning function, including but not limited to inductive reactors (" Choke coils"), transformers, filters, transistors, gap core rings, inductors (coupled or otherwise), capacitors, resistors, operational amplifiers, and diodes, whether individually or in combination as discrete components or integrated circuit.

[0031] As used herein, the term "permeance" refers to any number of materials commonly used to form inductive magnetic cores or similar components, including but not limited to various formulations made of ferrite.

[0032]As used herein, the term "signal conditioning" or "conditioning" should be understood to include, but not limited to, signal transformation, filtering and noise mitigation, signal separation, impedance control and correction, current limiting, capacitance control, ...

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PUM

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Abstract

The present invention discloses an improved low cost and highly consistent inductive device. In one embodiment, the low cost and highly consistent inductive device solves the problems associated with the so-called conductive anodic filaments CAF that occur within these laminated structures. These conditions include high humidity, high bias voltage (i.e., large voltage differential), high moisture content, surface and resin ionic impurities, glass-to-resin bond weakness, and exposure to high assembly temperatures. In a variant, mixed-mode coupling techniques are utilized in order to extend the fundamental operating bandwidth of the substrate inductive device. The invention also discloses methods of making and using the aforementioned substrate inductive devices.

Description

[0001] Priority and Related Applications [0002] This application claims priority benefit to commonly-owned U.S. Patent Application Serial No. 14 / 057,900 of the same title, filed October 18, 2013, which asserts priority to a patent filed on November 7, 2012, entitled "Lining Substrate Inductive Device Methods and Apparatus," commonly owned U.S. Provisional Patent Application No. 61 / 723,688, the contents of each of which are incorporated by reference in their entirety incorporated into this article. [0003] This application is also related to commonly owned and co-pending U.S. Patent Application Serial No. 13 / 797,530 of the same title, filed March 12, 2013, which claims the same Priority to titled US Provisional Patent Application No. 61 / 723,688, the contents of each of the foregoing are hereby incorporated by reference in their entirety. This application is also related to commonly owned and co-pending U.S. Patent Application Serial No. 11 / 985,156, filed November 13, 2007, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01F27/24H01F27/28H01R13/66
CPCH01F17/0033H01F5/00H01F17/06H01F27/28H01F41/04H01F41/046H01F2017/002Y10T29/4902
Inventor T·迪恩M·萨布瑞M·格林H·阿贝德玛摩尔
Owner PULSE ELECTRONICS
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