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Wafer processing technique for vertically integrating PLC waveguide with infrared receiver

A processing technology and receiver technology, applied in the coupling of optical waveguide, optical waveguide light guide, light guide, etc., can solve the problems of large volume of integrated module devices, inability to adapt to application requirements, and high processing cost, so as to achieve simple processing technology and avoid labor force The effect of low consumption and production cost

Active Publication Date: 2015-11-11
湖南晶图科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In view of the high processing cost and complex operation of the optical components and PLC chip integrated modules in the prior art, and the large volume of the integrated module device, it cannot meet the existing application requirements. The purpose of the present invention is to provide a simple operation and low cost. Wafer processing technology that can realize the tight integration of infrared light sensing devices and PLC waveguides

Method used

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  • Wafer processing technique for vertically integrating PLC waveguide with infrared receiver
  • Wafer processing technique for vertically integrating PLC waveguide with infrared receiver
  • Wafer processing technique for vertically integrating PLC waveguide with infrared receiver

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Embodiment 1

[0036] Raw material: PLC wafer; The raw material is a PLC wafer (such as figure 1 shown in a); the thickness of the substrate is about 18 microns, the thickness of the cladding layer is about 19 microns, the width of the waveguide core is about 6 microns, and the thickness is about 6 microns. The PLC wafer has 16 output channels.

[0037] (1) Etch an inverted trapezoidal groove (such as figure 1 As shown in b), the depth of the groove is about 12 microns, the width of the bottom of the groove is about 30 microns, the length is about 120 microns, and the thickness of the remaining covering layer on the waveguide core layer is about 1 micron. The photolithography process includes laying photoresist, exposure and development to form a pattern, and then transfers the pattern to the cover layer by dry etching.

[0038] (2) Deposit a photosensitive layer (polycrystalline germanium) on the bottom of the inverted trapezoidal groove, with a thickness of about 0.6 microns, and the w...

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Abstract

The invention discloses a wafer processing technique for vertically integrating a PLC waveguide with an infrared receiver. The technique comprises steps of: processing a groove on the surface of a covering layer, close to an output end, of a PLC waveguide; depositing a photosensitive layer on the bottom of the groove; depositing a protective layer on the surface of the photosensitive layer and the surface of the covering layer and processing a groove on the surface of the protective layer on each of both ends of the bottom of the groove; depositing a metallic layer on the bottom of the groove and the surface of the protective layer and processing the metallic layer to be an electrode metallic lead; and depositing another protective layer on the electrode metallic lead and the surface of the protective layer and processing a wiring port. The technique achieves tight integration that the output end of the waveguide and a photoreceptor based on a germanium compound crystal are coupled on the wafer and a waveguide core and an infrared photoreceptor are vertically coupled such that maximum signal current output of the photoreceptor is easy to acquire. The processing technique is simple and low in production cost, and prevents consumption of a plenty of labor force.

Description

technical field [0001] The invention relates to a wafer processing technology for vertically integrating a PLC waveguide and an infrared receiver, and belongs to the field of waveguide device preparation. Background technique [0002] With the expansion of the application of PLC planar waveguide chip devices from wide area network to intercity network and access network, more and more optical components need to be integrated with PLC chips to achieve high integration and high performance of application modules. Smaller and denser index requirements will be required to be implemented on some modules, such as TOSA (Optical Transmitter Subassembly Module) and ROSA (Optical Receiver Subassembly Module). In the past, in the application module of the wide area network, the laser, the waveguide chip, and the optical receiver usually used discrete components. In the prior art, the method of assembling separate optical devices is generally to reflect the light to the photodiode thro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/42G02B6/12
CPCG02B6/12G02B6/4201
Inventor 叶旻
Owner 湖南晶图科技有限公司