A thin-film structure LED chip based on silver-based metal bonding and preparation method thereof
A technology of LED chip and thin film structure, which is applied in the direction of semiconductor devices, electrical components, circuits, etc.
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[0069] In the following, in conjunction with the accompanying drawings, the present invention will be further described by taking an LED chip with a vertical structure as an example.
[0070] Such as figure 1 As shown, the thin-film LED chip unit of the vertical structure of this embodiment includes: a transfer substrate 0, a bonding metal layer 1, a transition layer 2, a reflective layer 3, a p-electrode 4, an LED epitaxial layer 5, an n-electrode 6, n Surface light cone 7 and passivation layer 8; among them, on the transfer substrate 0 from bottom to top, there are bonding metal layer 1, transition layer 2, reflective layer 3, p electrode 4 and LED epitaxial layer 5; in the LED epitaxial layer The n-electrode 6 is formed on a small part of the LED epitaxial layer; the n-side light-emitting cone 7 is formed on the surface of the LED epitaxial layer except for the n-electrode; the reflective layer 3 and the n-side light-emitting cone form a light-emitting structure; between the LE...
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