Manufacturing method of packaging material plate

Abstract

A manufacturing method of a packaging material plate includes the steps that mechanical peeling is conducted on the surface of a deposited round ingot, the two end faces of the deposited round ingot are flattened, the processed deposited round ingot is heated to 370-500 DEG C, and the temperature is kept for 2-6 h; according to the needed specification, an extrusion female die is assembled; after assembly, an extrusion male die and the extrusion female die are assembled on an extrusion machine, and the female die cannot move after being assembled; the dies and an ingot containing barrel are pre-heated as a whole and heated to 350-450 DEG C, and the temperature is kept for 12-18 h; hot extrusion is performed to form the plate, and the extrusion running speed of an extrusion rod is 0.5-2.5 mm / s; the extrusion ratio is 3-27; and the packaging material plate formed through extrusion is cooled to room temperature through air, and then common sawing discharging of the plate is performed. The method is simple in technology, and can achieve large-scale production and improve forming efficiency. Direct hot extrusion is conducted on the deposited round ingot to form the plate of the required specification, and therefore the material utilizing rate is greatly increased and the sampling efficiency is greatly improved; and by replacing hot isostatic pressing densification treatment with a hot extrusion procedure, structural densification is achieved, densification treatment cost is effectively reduced, and densification efficiency is improved.

Description

technical field [0001] The invention relates to a method for preparing a packaging material plate, in particular to a method for preparing an Al-Si alloy packaging material plate Background technique [0002] Al-Si alloy is a typical electronic packaging material, which is widely used to package various electronic chips. At present, the spray deposition preparation process of Al-Si alloy is relatively mature. The principle is to atomize the Al-Si melt into tiny solid particles and semi-solid melt under the atomization of nitrogen (or other inert gas, etc.) as the carrier. The particles and droplets in the jet hit the high-speed rotating deposition disk for energy conversion, deformation and spreading, and are cooled, solidified and stacked at a relatively high speed to form Al-Si alloy deposition ingots. According to the packing theory, voids (pores) are inevitably formed in the Al-Si alloy deposition ingot formed by stacking deposition of solid particles and semi-solid dro...

AI Technical Summary

Problems solved by technology

The above-mentioned patent documents mainly involve the preparation method and process of packaging materials, but not the preparation method of the plates required for packaging parts. The packaging materials involved in the literature and patents mainly use hot isostatic pressing + wire cutting technology to prepare slabs for packaging parts , there are disadvantages such as low efficiency of hot isostatic pressing, long working hours of wire cutting, low material utilization rate, and high manufacturing cost.

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