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Ultraviolet/heating-curing epoxy resin adhesive and preparation method thereof

An epoxy resin, dual-curing technology, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problem of poor compatibility and stability, poor stability of compatibilizer, and poor crosslinking density Insufficient and other problems, to avoid compatibility and stability problems, solve storage stability, and reduce storage costs

Inactive Publication Date: 2015-12-02
连云港华海诚科电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

But these are two chemical systems, and these two systems have problems of poor compatibility and stability
The two systems interact with each other, resulting in insufficient crosslinking density and poor bonding performance
In addition, due to the poor stability of the compatibilizer, existing products need to be stored below -18 degrees, and the storage cost is high

Method used

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  • Ultraviolet/heating-curing epoxy resin adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] Example 1, an epoxy resin adhesive that can be double-cured by ultraviolet heating, which is made of the following mass percentage of raw materials:

[0047] Bisphenol A epoxy resin 20%, alicyclic epoxy resin 50%,

[0048] Aromatic sulfonium salt 2%, hexafluoroantimonate 1%,

[0049] Aliphatic glycidyl ether 12%, polyester diol 10%,

[0050] Fumed silica 4%, carbon black 1%.

Embodiment 2

[0051] Embodiment 2, an epoxy resin adhesive that can be double-cured by ultraviolet heating, which is made of the following mass percentage of raw materials:

[0052] Bisphenol A type epoxy resin 10%, bisphenol F type epoxy resin 15%, alicyclic epoxy resin 45%,

[0053] Aromatic iodonium salt 2%, hexafluoroantimonate 2%,

[0054] Aliphatic diglycidyl ether 10%, cross-linked acrylate polymer 13%,

[0055] Organic bentonite 3%, Sudan black 1%.

Embodiment 3

[0056] Example 3, an epoxy resin adhesive that can be double-cured by ultraviolet heating, which is made of the following mass percentage of raw materials:

[0057] Bisphenol A type epoxy resin 30%, alicyclic epoxy resin 35%,

[0058] Aromatic sulfonium salt 1%, aromatic iodonium salt 2%,

[0059] Hexafluoroantimonate 2%, fumed silica 5%,

[0060] Aliphatic glycidyl ether 8%, aliphatic diglycidyl ether 5%,

[0061] Polyester diol 6%, cross-linked acrylate polymer 5%,

[0062] Carbon black 0.5%, Sudan black 0.5%.

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Abstract

The invention relates to a preparation method of an ultraviolet / heating-curing epoxy resin adhesive. The ultraviolet / heating-curing epoxy resin adhesive is prepared from the following raw materials in percentage by mass: 50-70% of epoxy resin, 1-5% of ultraviolet initiator, 1-5% of thermal initiator, 5-20% of diluter, 5-20% of toughener, 1-10% of thixotropic agent and 1-2% of colorant. The ultraviolet / heating-curing epoxy resin adhesive only adopts the epoxy resin system; and the single resin system can better solve the problems in storage stability, compatibility and binding force. The epoxy resin system is utilized to simultaneously implement ultraviolet curing and heat curing, thereby avoiding the problems in compatibility and stability caused by different resin systems. By adopting hexafluoroantimonate as the thermal initiator, the ultraviolet / heating-curing epoxy resin adhesive has high stability, and can implement storage at 2-10 DEG C without stratification, thereby lowering the storage cost.

Description

Technical field [0001] The invention relates to an adhesive, in particular to an epoxy resin adhesive that can be double-cured by ultraviolet heating, and also relates to the above-mentioned preparation method. Background technique [0002] Epoxy resin adhesive is mainly used in the assembly of camera modules. It is a technology that pre-fixes the camera components through UV curing and then heats them to achieve complete curing. Nowadays, the pixels of mobile phone cameras are getting higher and higher, and high pixels can be realized by chips, but if the focus of the chip and the focus of the lens are inconsistent during the assembly of the camera, the imaging effect will be greatly reduced. In traditional assembly, the lens is fixed on the chip substrate by adhesive, and the curing of the adhesive is achieved by heating. When the component is moved to the oven, the focused component is prone to offset and cannot meet the imaging requirements of high pixels. Therefore, a proce...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C09J11/06C09J11/08
Inventor 秦苏琼刘兆明郭克楠陶滕腾谢雷陶军
Owner 连云港华海诚科电子材料有限公司
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