Processing method for manufacturing crystal base plate of quartz-crystal resonator

Abstract

The invention discloses a processing method for manufacturing a crystal base plate of a quartz-crystal resonator. The processing method comprises steps of using chemical solvent to process and erode the crystal base plate according to preset size of erosion area and erosion time, thereby achieving that thickness of a designated area of the crystal base plate is changed according to preset design and form, and achieving the edge chamfering effects of chemical erosion; and then manufacturing the crystal resonator. The chemical solvent is hydrogen fluoride NH4HF2 solution. Segmentation and partition erosion can be used in the method, and the method is characterized by low cost, short time, controllable surface damage and less loss. As a novel quartz-crystal processing technology and method, electrical performance parameters of the resonator can be improved. The processing method is characterized in that performance parameters of materials can be changed; the specific mode of the thickness or rigidity of the designed crystal plate is changed; energy trapping performance of the crystal resonator is achieved; and quite small shearing vibration on the edge of the crystal plate are ensured, thereby reducing diffusion of energy towards outside and achieving the objective to enhance shearing vibration.

Description

technical field [0001] The invention relates to a shear type quartz crystal resonator, in particular to a processing method for realizing the chamfering effect of the crystal substrate of the quartz crystal resonator by using a chemical erosion method. Background technique [0002] In the design and manufacture of quartz crystal resonators, in order to obtain a better quality factor of the resonator and suppress the negative effects of bending and other harmful vibrations in the resonator on the electrical characteristics, it is generally necessary to change the edge thickness of the quartz crystal plate. In this way, the goal of reducing parasitic vibration interference and enhancing thickness-shear vibration and "energy trapping" characteristics is achieved. Usually, high-performance crystal resonators need to reduce bending and other parasitic vibrations as much as possible, especially the vibration at the edge of the quartz crystal plate, so as to ensure that the deforma...

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Problems solved by technology

Therefore, the control of the chamfering effect by the traditional process is mainly limited to the appropriate thickness change. If the product performance meets the requirements, it is generally not necessary to make strict regulations on the thickness change mode.

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