69 results about "Sidewall roughness" patented technology

A method for silicon micromachining techniques based on high aspect ratio reactive ion etching with gas chopping has been developed capable of producing essentially scallop-free, smooth, sidewall surfaces. The method uses precisely controlled, alternated (or chopped) gas flow of the etching and deposition gas precursors to produce a controllable sidewall passivation capable of high anisotropy. The dynamic control of sidewall passivation is achieved by carefully controlling fluorine radical presence with moderator gasses, such as CH₄ and controlling the passivation rate and stoichiometry using a CF₂ source. In this manner, sidewall polymer deposition thicknesses are very well controlled, reducing sidewall ripples to very small levels. By combining inductively coupled plasmas with controlled fluorocarbon chemistry, good control of vertical structures with very low sidewall roughness may be produced. Results show silicon features with an aspect ratio of 20:1 for 10 nm features with applicability to nano-applications in the sub-50 nm regime. By comparison, previous traditional gas chopping techniques have produced rippled or scalloped sidewalls in a range of 50 to 100 nm roughness.

In accordance with the invention, an article comprising a nanoscale surface pattern, such as a grating, is provided with a nanoscale patterns of reduced edge and/or sidewall roughness. Smooth featured articles, can be fabricated by nanoimprint lithography using a mold having sloped profile molding features. Another approach uses a mold especially fabricated to provide smooth sidewalls of reduced roughness, and a third approach adds a post-imprint smoothing step. These approaches can be utilized individually or in various combinations to make the novel articles.

A through-silicone-via etching method comprises steps as follows: providing a to-be-etched silicon substrate; etching the silicon substrate through first etching to form an opening; forming protecting layers on the side wall and the bottom of the opening through passivation deposition; etching the bottom of the opening through second etching, wherein the pressure of an etching chamber of the second etching is smaller than that of etching chambers of the first etching and the passivation deposition; and treating the silicon substrate sequentially and circularly through the first etching, the passivation deposition and the second etching until a through-silicone-via is formed. The roughness of the side wall of the formed through-silicone-via is low.

The invention discloses a method and device for rapidly measuring sidewall appearance of a micro-nano deep groove structure, which can simultaneously and rapidly measure the parameters of the sidewall appearance of the micro-nano deep groove structure, such as line width, groove depth, sidewall angle, sidewall roughness and the like. The method comprises the steps of: projecting elliptical polarized lights, which is obtained by polarizing light beams with the wavelengths ranging from near infrared waveband to middle infrared waveband, onto the surface of a structure to be measured; collecting zero-level diffraction signals on the surface of the structure to be measured, and calculating to obtain a measured infrared spectroscopic ellipsometry of the micro-nano deep groove structure; calculating theoretical spectroscopic ellipsometries in the near infrared waveband and the middle infrared waveband respectively by using a wavelength allocation modeling method, matching the theoretical spectroscopic ellipsometries with the infrared spectroscopic ellipsometry measured in the experiment by using a stepwise spectral inversion method, and sequentially extracting the groove structure parameter and the roughness parameter. The device comprises an infrared light source, first, second, third and fourth off-axis parabolic mirrors, a Michelson's interferometer, a planar reflector, a polarizer, a sample bench, an analyzer, a detector and a computer; and the method is a noncontact, nondestructive low-cost method for rapidly measuring the sidewall appearance.

Provided is a polymer useful as a base resin of a resist material featuring a high resolution, patterns with less sidewall roughness, practically acceptable etching resistance, and a substantial margin allowed for heat treatment temperature after exposure. The polymer has a weight-average molecular weight of from 1,000 to 50,000 and comprises at least one repeating unit of formula (1) below, at least one repeating unit of formula (2) below and at least one repeating unit of formula (3) below. A resist material comprising the polymer is also provided. In addition, provided is a pattern formation process comprising steps of applying the resist material onto a substrate, heating the film, exposing the heated film through a photomask to high energy radiation or electron beam, heating the exposed film and then developing with a developer.

Disclosed herein is an easy and well-integrated method of etching features to different depths in a crystalline substrate, such as a single-crystal silicon substrate. The method utilizes a specialized masking process and takes advantage of a highly selective etch process. The method provides a system of interconnected, variable depth reservoirs and channels. The plasma used to etch the channels may be designed to provide a sidewall roughness of about 200 nm or less. The resulting structure can be used in various MEMS applications, including biomedical MEMS and MEMS for semiconductor applications.

The invention provides a low-power laser-induced TIG electric arc-based additive manufacturing method of a stainless steel structural member and a manufacturing system. According to the method, a low-power laser and a TIG electric arc are taken as a composite heat source, an included angle relationship among a welding gun, the laser and a substrate is arranged according to a welding environment, astainless steel welding wire is fed into a molten pool through an additional wire feeding device, is stably melted and spread on the treated substrate, surfacing is carried out according to a plannedroute, and a stainless steel workpiece with a required structure is formed by accumulating layer-by-layer. According to the method and the system, the process of electric arc additive manufacturing is effectively improved through the addition of the low-power laser, the electric arc stability is increased, the irregular flowing of the molten pool is reduced, the roughness of a side wall of an additive wall body is effectively improved, the forming quality is improved, the processing allowance is reduced, and the utilization rate of a material is increased; and the method and the system have the characteristics of high efficiency and energy saving, and speediness, high precision, short period, low cost and the like are achieved when the complicated large-scale member is manufactured by themethod and the system.

The present invention relates to a method for forming an isolation film in a semiconductor device. After a trench for isolation is formed, a polymer film is stripped by a post cleaning process using BFN. A pre-treatment cleaning process using only SC-1 is performed and a sidewall oxidization process is then carried out. It is therefore possible to improve fail of the roughness of the trench sidewall and to easily strip polymer. Furthermore, since a conventional PET process is omitted, an isolation film manufacturing process is simplified. It is also possible to prohibit out-diffusion of dopants injected into a semiconductor substrate through a pre-treatment cleaning process using CLN N before the sidewall oxidization process. Incidentally, by forming a slope at the top corner of the trench, it is possible to prevent a gate oxide film thinning phenomenon that the gate oxide film thinner than a desired thickness is deposited at the trench corner. It is also possible to improve electrical properties of a device since an active region as much as a target critical dimension is secured.

The invention discloses an etching method of silicon chip grooves for an optical waveguide. The method includes: S1: a dielectric layer and a shielding layer are deposited on the surface of a silicon substrate in sequence, the dielectric layer is a silicon oxide layer or a silicon nitride layer, and the shielding layer is a polysilicon layer or an amorphous silicon layer; S2: shielding patterns of photoresist are formed on the surface of the shielding layer by employing a silicon groove processing photoetching mask; S3: the first etching of the shielding layer is performed by employing a dry method plasma etching process; S4: the polysilicon layer or the amorphous silicon layer after the first etching is regarded as the shielding layer, and the second etching of the dielectric layer is performed; S5: the shielding patterns of the photoresist are formed on the surface of the bare silicon substrate by employing a reverse mask of the silicon groove processing photoetching mask, and the third etching is performed; and S6: the residual dielectric layer is regarded as the shielding layer for silicon etching to obtain the required silicon grooves. According to the method, the roughness of sidewalls of the silicon grooves can be greatly improved, and the scattering loss and the transmission loss of the silicon-based optical waveguide are reduced.

Probe tips comprising tips and coatings are described. The tips and coatings may be selected to provide various probe-tip features, including, but not limited to, high reproducibility, high reliability, low cost, ultra-sharpness, high conductivity and/or simultaneous critical dimension imaging and sidewall roughness analysis.

The invention discloses a photolithography method capable of reducing line roughness. The method comprises the following steps: forming a structural material layer and hard mask layers on a substrate; forming electronic beam photoresist on the hard mask layers, then forming electronic beam photoresist graphics by executing electronic beam overexposure, wherein the exposure dose is increased so as to improve the roughness; taking the electronic beam photoresist graphics as the mask, forming hard mask graphics by etching; taking the hard mask graphics as the mask, and etching the structural material layer so as to formed the needed fine lines. In this method, a plurality of hard mask layers made of different materials is adopted and photolithography conditions are reasonably adjusted at the same time so as to prevent the roughness degree of the sidewall of the electronic beam photoresist from being transmitted to the structural material layer under the hard mask layers, thus the line roughness is effectively reduced, the technology stability is improved, and the fluctuation of device performance is reduced.

A monolithic micromachined waveguide device or devices with low-loss, high-power handling, and near-optical frequency ranges is set forth. The waveguide and integrated devices are capable of transmitting near-optical frequencies due to optical-quality sidewall roughness. The device or devices are fabricated in parallel, may be mass produced using a LIGA manufacturing process, and may include a passive component such as a diplexer and/or an active capping layer capable of particularized signal processing of the waveforms propagated by the waveguide.

A hybrid strip-loaded EO polymer/sol-gel modulator in which the sol-gel core waveguide does not lie below the active EO polymer waveguide increases the higher electric field/optical field overlap factor Γ and reduces inter-electrode separation d thereby lowering the modulator's half-wave drive voltage Vπ, reducing insertion loss and improving extinction. The strip-loaded modulator comprises an EO polymer layer that eliminates optical scattering caused by sidewall roughness due to etching. Light does not encounter rough edges as it transitions to and from the sol-gel and EO polymer waveguides. This reduces insertion loss.

The invention belongs to the semiconductor integration technology field and discloses a method for reducing silicon-based optical waveguide sidewall roughness. The method for reducing the silicon-based optical waveguide sidewall roughness comprises steps of providing a substrate, forming a silicon-based optical waveguide line on the substrate, performing hydrogen annealing on the substrate containing the silicon-based optical waveguide line, wherein pressure of a chamber, on which hydrogen annealing is performed, is 20Torr-latmn. The method for reducing silicon-based optical waveguide sidewall roughness solves a problem that the silicon-based optical waveguide sidewall roughness is too big. The method of the invention is simple, can better maintain the features and sizes of the silicon-based optical waveguide lines and achieves a technical effect that the silicon-based optical waveguide sidewall roughness can be reduced under chamber pressure of 20Torr-latm.

The light-guiding structure includes a waveguide structure that comprises a substrate and a low refractive index underclad material. The waveguide structure is oxidized to form an oxidized layer on a surface of the waveguide structure. The oxidized layer is isotropically etched after the reaction-limited oxidation regime is approaching the diffusion-limited regime and repeatedly oxidized and etched so that the waveguide structure is continuously oxidized in the reaction-limited regime, reducing the overall time of oxidation and volume of oxidized material so that the waveguide structure has its sidewall roughness reduced efficiently enabling high transmission rates of guided light.

The invention discloses a fine line preparation method which comprises the steps of forming a structural material layer and hard mask layers on a substrate, forming electron beam photoresist on the hard mask layers and performing electron beam exposure to form an electron beam photoresist pattern, carrying out etching with the use of the electron beam photoresist pattern as a mask to form a hard mask pattern, and etching the structural material layer with the use of the hard mask pattern as a mask to form a needed fine line. According to the method of the invention, a plurality of hard mask layers of different materials are adopted and etching reaction conditions are reasonably adjusted, the roughness of the side wall of the electron beam photoresist is prevented from being transferred to the lower structural material layer, the line roughness is effectively reduced, the process stability is improved, and the fluctuation of device performance is reduced.

Resist compositions comprising nitrogen-containing organic compounds having a benzimidazole structure and a specific ether chain moiety have an excellent resolution, form precisely configured patterns with minimized roughness of sidewalls and are useful in microfabrication using electron beams or deep-UV light.