Low-silver-copper-phosphorus brazing material containing trace indium

A solder, silver-copper technology, used in welding/cutting media/materials, welding media, metal processing equipment, etc., can solve problems such as waste, unqualified materials, and solder overflow, and achieve suitable fluidity and spreadability. and liquidity effects

Inactive Publication Date: 2015-12-16
HANGZHOU HUAGUANG ADVANCED WELDING MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Copper-based solders such as BCu80AgP (15% silver content) are commonly used in the brazing of copper and copper alloys in the refrigeration industry. However, due to their excessive fluidity

Method used

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Experimental program
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Effect test

Embodiment Construction

[0013] 1) The copper-based brazing material in the present invention uses 1# silver, No. 1 standard copper, copper-phosphorus alloy, In99.993 and mixed rare earth, according to the above ratio, it is smelted and cast in a conventional intermediate frequency melting furnace, and then stripped by sawing , extruding, drawing, forming, cleaning and other processes; 2) According to Cu, copper phosphorus, Ag, In, add smelting in sequence, and finally add a small amount of mixed rare earth, and then pass casting, sawing, extrusion, drawing, Forming, cleaning and other processes are prepared. The obtained brazing material has a melting temperature range of 600-780°C and can be processed into welding rods, welding wires, welding rings and other brazing materials of various specifications and sizes. For brazing connections of brass components in the refrigeration industry.

[0014] A kind of low-silver copper-phosphorus solder containing trace indium of the present invention, the produ...

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PUM

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Abstract

The invention relates to a low-silver-copper-phosphorus brazing material containing trace indium. The low-silver-copper-phosphorus brazing material is characterized by comprising the following components in percentage by weight: 1.0-3.0% of silver, 6.7-8% of phosphorus, 0.05-0.2% of indium, 0.01-0.05% of mixed rare earth and the balance of copper, wherein the melting temperature range of the brazing material is 600-780 DEG C. The low-silver-copper-phosphorus brazing material has the advantages that the low-silver-copper-phosphorus brazing material can be used for replacing a BCu80AgP copper-based brazing material during brazing copper alloys, the content of the silver is reduced, the low-silver-copper-phosphorus brazing material has appropriate spreadability and liquidity, the low-silver-copper-phosphorus brazing material has appropriate liquidity during brazing copper and copper alloys, the brazing process is high in performance, stable in quality and smooth in surface, the technique performance index is equivalent to that of the Bag15CuP copper-based brazing material, and the brazing material can be prepared into various forms such as filaments, rings and strips by improving the molding technique.

Description

technical field [0001] The invention relates to a low-silver copper-phosphorus solder containing a small amount of indium, which is suitable for brazing between copper and copper alloys, and belongs to a medium-temperature brazing material. Background technique [0002] In recent years, due to the overall increase in the price of precious metal raw materials, and to save the limited domestic precious metal materials, it has become a major development direction of the industry to develop new solder with lower silver content to replace conventional solder with higher silver content. [0003] Copper-based solders such as BCu80AgP (15% silver content) are commonly used in the brazing of copper and copper alloys in the refrigeration industry. However, due to their excessive fluidity on the surface of the base metal in the molten state, it is easy to cause the solder to overflow and affect the appearance or even Cause welding workpiece unqualified and cause material waste. Conte...

Claims

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Application Information

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IPC IPC(8): B23K35/30
CPCB23K35/302
Inventor 王晓蓉余丁坤方健黄世盛陈融朱佳丽
Owner HANGZHOU HUAGUANG ADVANCED WELDING MATERIALS CO LTD
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