IGBT module heat-radiation apparatus

Abstract

The invention discloses an IGBT module heat-radiation apparatus. The air temperature in an air inlet position is low while the air temperature in an air outlet position is high. The IGBT module heat-radiation apparatus comprises a plate-fin type radiator. The radiator comprises a plurality of fins. A plurality of projections are arranged inside a fin channel of the plate-fin type radiator. The projections are sequentially increasing from the air inlet position of the plate-fin type radiator to the air outlet position of the plate-fin type radiator. By arranging projections of different densities in the plate-fin type radiator channel to adjust the thermal resistance along the air flow direction, the heat-radiation apparatus has the thermal resistance decreased with the air flow direction. The temperature uniformity of the IGBT module heat-radiation apparatus is thus guaranteed. The IGBT module reliability is further improved.

Description

technical field [0001] The invention relates to the field of electronic packaging, in particular to a cooling device for an IGBT module. Background technique [0002] IGBT module (InsulatedGateBipolarTransistor, Chinese translation is insulated gate bipolar transistor), the IGBT chip, drive circuit, control circuit and protection circuit are packaged inside a module to form a fully functional and versatile power electronics integrated module, with The advantages of convenient control, fast switching speed, high operating frequency, and large safe working area have been widely used in consumer electronics, medical equipment, smart grids, and rail transit, and play an important role in energy conservation and energy efficiency. [0003] With the increase of application range and application requirements of IGBT module, it will definitely develop in the direction of smaller size, higher integration, stronger performance and reliability. From the perspective of power electronics...

AI Technical Summary

Problems solved by technology

However, the disadvantages of this patent are that when the airflow flows through the radiator evenly, the temperature of the air inlet is low and the temperature of the air outlet is high, the temperature distribution of the whole radiator is uneven during the working process, and the thermal stress of each position of the IGBT module bottom plate is different. , long-term operational reliability is severely affected, Figure 2 ~ Figure 3 It is a simulation diagram of the bottom plate temperature and chip temperature distribution of the plate-fin radiator using the finite element analysis software ANSYS. The maximum temperature Tmax=65.05371°C, and the temperature uniformity is poor

However, in the prior art, there is no structural design for temperature uniformity

Images