Electronic product shell with carbon fiber and plastic integrated structure and manufacturing method thereof

Abstract

An electronic product shell with a carbon fiber and plastic integrated structure comprises a carbon fiber sheet structure and a plastic structure formed on the carbon fiber sheet structure through injection molding, wherein a pore is formed in the carbon fiber sheet structure, and part of the plastic structure is formed in the pore so as to be buckled and fixed together with the carbon fiber sheet structure through the pore. A method for manufacturing the electronic product shell with the carbon fiber and plastic integrated structure comprises the step of injection molding of the plastic structure. During injection molding of the plastic structure, injection is conducted on the carbon fiber sheet structure provided with the pore to enable part of the plastic structure formed through injection molding to be formed in the pore, and then the plastic structure and the carbon fiber sheet structure are buckled and fixed together through the pore. By the adoption of the electronic product shell with the carbon fiber and plastic integrated structure and the manufacturing method thereof, the plastic part and the carbon fiber part of the shell can be combined seamlessly, and the structure is firmer and more reliable.

Description

technical field [0001] The invention relates to an electronic product casing, in particular to an electronic product casing with an integral structure of carbon fiber and plastic and a preparation method thereof. Background technique [0002] With the continuous development of electronic products and the wide application of new materials, the shells of electronic products are becoming more and more diverse. At present, in the domestic electronic industry, it is a trend to apply carbon fiber to electronic products. Carbon fiber material not only has the elegant and firm characteristics of aluminum-magnesium alloy, but also has the plasticity of ABS engineering plastics, and its strength and thermal conductivity are superior to ordinary ABS plastics. Its appearance is similar to plastic, but its strength and thermal conductivity are superior to ordinary ABS plastic. It is a sustainable material and has more and more applications in electronic products, including tablet compute...

AI Technical Summary

Problems solved by technology

This process has high requirements on the adhesiveness of the glue. After a long time of bonding, moisture and dust can easily penetrate into it through the gap between carbon fiber and plastic, making the glue invalid, so there is a risk of falling off, and the service life of the product will be greatly reduced. Reduced, poor quality stability

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