Hot-rolled copper plate

Abstract

This hot-rolled copper plate is made from pure copper having a purity of 99.99 mass% or greater, the average crystal grain diameter being 40 microns or less, and the (Sigma 3+Sigma 9) grain boundary length ratio (L(sigma 3 + sigma 9) / L), which is the ratio between the total crystal grain boundary length (L) measured by the EBSD method and the sum (L(sigma 3 + sigma 9)) of the Sigma 3 grain boundary length (L sigma 3) and the Sigma 9 grain boundary length (L sigma 9) is 28% or greater.

Description

technical field [0001] The present invention relates to a tube plate suitable for use in sputtering targets, backing plates, Steve molds (Stevemold), electron tubes for accelerators, magnetrons, superconducting stabilization materials, heat dissipation substrates, vacuum components, and heat exchangers. Hot-rolled copper sheets for copper processed products such as bars, electrode materials, and anodes for electroplating. [0002] This application claims priority based on Patent Application No. 2013-080844 for which it applied in Japan on April 8, 2013, and uses the content here. Background technique [0003] Conventionally, as a copper plate made of pure copper used in the above-mentioned copper processed products, it is generally manufactured through the steps of casting an ingot of pure copper and hot working (hot rolling or hot forging) of the ingot. The hot working process, the cold working process of cold working (cold rolling or cold forging), and the heat treatment ...

AI Technical Summary

Problems solved by technology

[0014] However, in the above-mentioned conventional copper plate (sputtering target material), after hot working (hot forging and hot rolling) of the pure copper ingot, it is necessary to perform cold working (cold forging and cold rolling) and heat treatment, and the number of steps is relatively large. Many, the problem that the manufacturing cost becomes high

In addition, in order to perform cold working (cold forging and cold rolling), there is a disadvantage that it is difficult to suppress the residual stress of the copper plate to a low level.

[0015] In addition, in the above-mentioned copper plate, although the crystal grains are made finer, the fatigue characteristics when repeated stresses are not sufficient, such as the cooling and heating cycles of the heat dissipation substrate.

In addition, when the above-mentioned copper plate is used as a target for sputtering, abnormal discharge during sputtering at high output cannot be sufficiently suppressed.

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