Alignment sensor, lithographic apparatus and alignment method

A sensor and relative orientation technology, applied in optomechanical equipment, optics, instruments, etc., can solve problems such as inability to detect asymmetry

Inactive Publication Date: 2015-12-23
ASML NETHERLANDS BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in dark field detection, these orders add up, making it impossible to detect asymmetry

Method used

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  • Alignment sensor, lithographic apparatus and alignment method
  • Alignment sensor, lithographic apparatus and alignment method
  • Alignment sensor, lithographic apparatus and alignment method

Examples

Experimental program
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Embodiment Construction

[0032] figure 1 A lithographic apparatus according to one embodiment of the invention is schematically shown. Equipment includes:

[0033] an illumination system (illuminator) L configured to condition a radiation beam B (eg UV radiation or EUV radiation);

[0034] a support structure (e.g. a mask table) MT configured to support a patterning device (e.g. a mask) MA and connected to a first positioner PM configured to precisely position the patterning device according to certain parameters;

[0035] A substrate table (e.g., wafer table) WT configured to hold a substrate (e.g., a resist-coated wafer) W and connected to a second positioner configured to precisely position the substrate according to certain parameters PW; and

[0036] A projection system (eg a refractive projection lens system) PS is configured to project the pattern imparted to the radiation beam B by the patterning device MA onto a target portion C of the substrate W (eg comprising one or more dies).

[003...

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PUM

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Abstract

Disclosed is an alignment sensor comprising, and associated method comprising an illumination source, such as a white light source, having an illumination grating operable to diffract higher order radiation at an angle dependent on wavelength; and illumination optics to deliver the diffracted radiation onto an alignment grating from at least two opposite directions. For every component wavelength incident on the alignment grating, and for each direction, the zeroth diffraction order of radiation incident from one of the two opposite directions overlaps a higher diffraction order of radiation incident from the other direction. This optically amplifies the higher diffraction orders with the overlapping zeroth orders.

Description

[0001] Cross References to Related Applications [0002] This application claims priority to US Provisional Application 61 / 820,568, filed May 7, 2013, which is hereby incorporated by reference in its entirety. technical field [0003] The present invention relates to an alignment sensor and an alignment method, such as those used in photolithography processes. Background technique [0004] A lithographic apparatus is a machine that applies a desired pattern onto a substrate, usually onto a target portion of the substrate. A lithographic apparatus may be used, for example, in the manufacture of integrated circuits (ICs). In this case, a patterning device, alternatively called a mask or reticle, may be used to create the circuit pattern to be formed on the individual layers of the IC. The pattern can be transferred onto a target portion (eg, a portion comprising one or several dies) on a substrate (eg, a silicon wafer). The transfer of the pattern is usually done via imagi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F9/00
CPCG03F9/7069G03F9/7088G03F9/7092G01B11/272G03F7/70141
Inventor A·J·登博夫S·马蒂杰森P·蒂内曼斯
Owner ASML NETHERLANDS BV
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