Circuit board with digital signal isolation circuit chip and packaging method

Abstract

The invention discloses a circuit board with a digital signal isolation circuit chip and a packaging method. The circuit board includes a substrate and one or a plurality of digital signal isolation circuit chips, wherein the digital signal isolation circuit chip is packaged on the substrate through a flip-chip bonding mode. The flip-chip bonding packaging technology is adopted in a digital signal isolation circuit, and therefore, problems caused by bonding and interconnection can be greatly reduced, and the reliability of the chip can be improved.

Description

technical field [0001] The invention relates to a digital signal isolation circuit, in particular to a circuit board with a digital signal isolation circuit chip and a packaging method using flip-chip packaging technology (Flip-chip). Background technique [0002] Digital signal isolation chip is a chip that can realize separate power supply for input and output, and completely isolate the signals at both ends. Now it has been widely used in military electronic systems and aerospace electronic equipment, especially in some occasions where the application environment is relatively harsh. Isolation chips not only eliminate noise, but also protect devices (or people) from high voltage hazards. With the rapid development of digital circuits and communication industries, digital isolation chips will also be more widely used. [0003] Nowadays, the chip size of integrated circuits is getting smaller and smaller, and the miniaturization of electronic products and electronic system...

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Problems solved by technology

However, there will be parasitic resistance, capacitance, and inductance on the bonding wire, and at the same time, the cavity in the chip will cause discharge, and the withstand voltage characteristic is low

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