Dicyandiamide type epoxy resin curing agent and preparation method and application thereof

An epoxy resin curing and epoxy resin technology, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of complicated process and low efficiency.

Active Publication Date: 2016-01-13
国科广化(南雄)新材料研究院有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

No matter which of the above methods is at the cost of sacrificing other aspects of per

Method used

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  • Dicyandiamide type epoxy resin curing agent and preparation method and application thereof
  • Dicyandiamide type epoxy resin curing agent and preparation method and application thereof
  • Dicyandiamide type epoxy resin curing agent and preparation method and application thereof

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Embodiment 1

[0059] The synthesis of embodiment 1 dicyandiamide epoxy resin curing agent

[0060] (1) Dissolve sodium dicyanamide and 4,4'-diaminodiphenylmethane in DMSO respectively to form a saturated DMSO solution; in an environment of inert gas, dissolve 4,4'-diaminodiphenylmethane The saturated DMSO solution of dicyanamide was slowly added dropwise to the saturated DMSO solution of sodium dicyanamide, reacted at 120°C for 6 hours, washed and dried to obtain a white solid;

[0061] (2) the white solid substance that step (1) is obtained is dissolved in DMSO, is made into saturated DMSO solution; Benzylamine is dissolved in DMSO, is made into saturated DMSO solution; The saturated DMSO solution of benzylamine is added dropwise to In the saturated DMSO solution of the white solid obtained in step (1), react at 90° C. for 10 h, then wash and dry to obtain a solid dicyandiamide epoxy resin curing agent, whose structural formula is shown in formula IV.

[0062]

Embodiment 2

[0063] The synthesis of embodiment 2 dicyandiamide epoxy resin curing agent

[0064] (1) Sodium dicyanamide and 4,4'-diaminodiphenylmethane were dissolved in DMSO respectively to form a saturated DMSO solution. In an inert gas atmosphere, 4,4'-diaminodiphenylmethane The saturated DMSO solution of dicyanamide was slowly added dropwise to the saturated DMSO solution of sodium dicyanamide, reacted at 80°C for 8 hours, washed and dried to obtain a white solid;

[0065] (2) the white solid substance that step (1) is obtained is dissolved in DMSO, is made into saturated DMSO solution, and benzylamine is dissolved in DMSO, is made into saturated DMSO solution; The saturated DMSO solution of benzylamine is added dropwise to In the saturated DMSO solution of the white solid obtained in step (1), react at 120° C. for 4 h, then wash and dry to obtain a solid dicyandiamide epoxy resin curing agent, whose structural formula is shown in formula IV.

Embodiment 3

[0066] The synthesis of embodiment 3 dicyandiamide epoxy resin curing agent

[0067] (1) Sodium dicyanamide and 4,4'-diaminodiphenylmethane were dissolved in DMSO respectively to form a saturated DMSO solution. In an inert gas atmosphere, 4,4'-diaminodiphenylmethane The saturated DMSO solution of dicyanamide was slowly added dropwise to the saturated DMSO solution of sodium dicyanamide, reacted at 100°C for 7 hours, washed and dried to obtain a white solid;

[0068] (2) the white solid substance that step (1) is obtained is dissolved in DMSO, is made into saturated DMSO solution; Benzylamine is dissolved in DMSO, is made into saturated DMSO solution; The saturated DMSO solution of benzylamine is added dropwise to In the saturated DMSO solution of the white solid obtained in step (1), react at 100° C. for 8 hours, then wash and dry to obtain a solid dicyandiamide epoxy resin curing agent, the structural formula of which is shown in formula IV.

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Abstract

The invention belongs to the technical field of chemical synthesis and particularly provides a dicyandiamide type epoxy resin curing agent and a preparation method and application thereof. The dicyandiamide type epoxy resin curing agent comprises a compound of the structure shown in formula I. The curing agent is structurally a dicyandiamide derivative type, can be dissolved in multiple types of organic solvent and mixed solvent, contains various curing groups, can conduct a curing reaction with epoxy resin rapidly and lowers the curing temperature. The compound serves as a latent curing agent for obtaining a one-component adhesive, a cure product after curing is good in heat resistance, and the mechanical property is remarkably improved as well compared with dicyandiamide.

Description

technical field [0001] The invention belongs to the technical field of chemical synthesis, and in particular relates to a dicyandiamide epoxy resin curing agent and a preparation method and application thereof. Background technique [0002] As the earliest thermal latent curing agent, dicyandiamide curing agent has the advantages of good stability, long pot life and good adhesion. It is widely used in powder coatings, adhesives and glass cloth laminates, but its high curing temperature and poor compatibility with epoxy resin limit its application. [0003] Among them, the Japanese patent (Show 52-5899.1977) obtained biguanide compound through amine modification of dicyandiamide can reduce the curing temperature and improve the solubility with epoxy resin, but the effect is not significant enough and the pot life is shortened as a price. [0004] Although the U.S. Patent (PCT / US92 / 09172) obtains dicyandiamide derivatives through reaction and has good solubility with epoxy re...

Claims

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Application Information

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IPC IPC(8): C08G59/50C09J163/02C09J11/06
Inventor 胡继文王永超林树东涂园园韩亚芳
Owner 国科广化(南雄)新材料研究院有限公司
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