Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Resin molding device and resin molding method

A resin mold and resin technology, applied in the fields of semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve problems such as poor quality of molded products, and achieve the effects of improving quality, preventing poor appearance, and preventing leakage.

Active Publication Date: 2016-01-27
APIC YAMADA CORP
View PDF6 Cites 13 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when compression molding is performed by supplying resin to a workpiece using this molding die, the resin placed in the center of the workpiece flows outward, and therefore, pores caused by entrapment of air, wiresweep, etc. are likely to occur. The problem of poor quality of molded products

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Resin molding device and resin molding method
  • Resin molding device and resin molding method
  • Resin molding device and resin molding method

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0079] First, refer to figure 1 The resin molding apparatus 100 of this embodiment will be described. figure 1 It is a diagram showing the overall configuration of the resin molding apparatus 100 in a planar layout. Needless to say, the structure for performing resin molding, the resin molding apparatus 100 also includes a structure for heat-curing (post-curing) a good product after inspecting a resin-molded work (molded product) and storing it.

[0080] The resin molding apparatus 100 includes a workpiece supply unit 110, a resin supply unit 120, a press unit 130, a workpiece inspection unit / cooling unit 140, a curing unit 150 (curing furnace), and a workpiece storage unit 160 as a processing unit that performs various processing steps. . Furthermore, the resin molding apparatus 100 includes a control unit 170 for controlling each processing step. It is only necessary to configure each processing unit by at least one, but in the present embodiment, a case where the resin...

no. 2 Embodiment approach

[0136] Compared with the first embodiment, in this embodiment, the workpiece loader 56 arranges (sets) the workpiece W together with the jig (the lower part of the upper die insert 37 ) on the upper die 31 , and the film loader 57 includes a heating There are differences in the parts, cooling parts, and gate parts. Below, refer to Figure 10 ~ Figure 14 The description will focus on this difference. Figure 10 ~ Figure 14 It is a schematic sectional view of the press part 130 of this embodiment.

[0137] As the workpiece W (substrate 10 ) becomes larger, the workpiece W is largely deflected (warped), so only the outer peripheral portion of the surface of the substrate 10 is used as in the first embodiment. 56 (support portion 61 ) holds the workpiece W, the substrate 10 bends due to its own weight and is difficult to hold in the mold, or falls during transportation. Therefore, in this embodiment, the plate-shaped jig 37A (member) is pushed against the back surface of the la...

no. 3 Embodiment approach

[0155] In the second embodiment, the film loader 57 uses the hand 63 that absorbs and holds the release film F on the side of the mounting surface on which the resin R is mounted, and supports the release film on the side opposite to the mounting surface. The case of the gate portion 70 of F is described. On the other hand, in the present embodiment, the film loader 57 is different in that the supporting resin R and the peeling film F are used and are arranged (set) as they are on the jig (member) of the lower mold 32 . Below, refer to Figure 15 ~ Figure 19 The description will focus on this difference. Figure 15 ~ Figure 19 It is a schematic sectional view of the press part 130 of this embodiment.

[0156] Like the second embodiment, in the shutter portion 70 supporting the release film F, it is necessary to wind up (remove) the shutter portion 70 when disposing the release film F on the lower mold 32 . At this time, there is a possibility that the distribution of the re...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
Login to View More

Abstract

The present invention addresses the problem of providing technology that is capable of improving the quality of moldings. As a solution, the lower mold (32) is provided with: a lower mold cavity piece (34) for configuring the bottom of a cavity (33); lower mold clampers (35) for configuring the sides of the cavity (33); a film loader (57) capable of holding and conveying a film (F) on which a resin (R) has been loaded; and a suction section (67) for picking up the film (F), which is disposed so as to cover the edges of the lower mold cavity piece (34) and the edges of the lower mold clampers (35). The lower mold cavity piece (34) moves relative to the lower mold clampers (35). The film loader (57) disposes the film (F) on the lower mold (32), in which the edges of the lower mold cavity piece (34) are held level with the edges of the lower mold clampers (35), so that the resin (R) is positioned above the lower mold cavity piece (34). The suction section (67) picks up and holds the film (F) so as to conform to the inner surface of the cavity (33) and supplies the resin (R) to the cavity (33).

Description

technical field [0001] The present invention relates to a technique effectively applied to a resin molding device and a resin molding method. Background technique [0002] For example, in the molding process of WLP (Wafer Level Package), it is carried out as follows: a large workpiece (for example, a workpiece in which a plurality of chip components mounted on a substrate are electrically connected to the substrate by bonding wires is placed on the lower mold), The upper die uses a molding die that constitutes a concave portion of the cavity (which becomes a cavity when the workpiece is clamped.). However, when compression molding is performed by supplying resin to a workpiece using this molding die, the resin placed in the center of the workpiece flows outward, and therefore, pores caused by entrapment of air, wiresweep, etc. are likely to occur. The problem of poor quality of molded products. [0003] On the other hand, the lower mold uses a molding die constituting the ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B29C43/36B29C43/32H01L21/56
CPCB29C43/18B29C43/36H01L21/561H01L21/565H01L24/97H01L2224/16225H01L2924/181H01L2924/00
Inventor 藤泽雅彦中泽英明村松吉和
Owner APIC YAMADA CORP
Features
  • Generate Ideas
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com