High-temperature resistance and low-temperature resistance PBT heat conduction and heat dissipating material, preparation method and applications thereof

Abstract

The present invention discloses a high-temperature resistance and low-temperature resistance PBT heat conduction and heat dissipating material, which comprises the following raw materials by mass: 30-70 parts of a PBT resin, 10-25 parts of a toughening agent, 10-50 parts of a heat conduction agent, 0.2-1.0 part of an antioxidant 1010, 0.2-1.0 part of a phosphite antioxidant 168, 0.5-1.0 part of a surfactant, and 0.2-1.0 part of a lubricant. The preparation method comprises: 1) carrying out a surface modification treatment on a heat conduction agent with a surfactant; 2) uniformly mixing the obtained modified heat conduction agent and other raw materials; and 3) carrying out extrusion granulation through a twin-screw extruder. The prepared heat conduction and heat dissipating material of the present invention has characteristics of low cost, excellent high-temperature resistance impact toughness, excellent low-temperature resistance impact toughness, excellent heat conduction property and excellent heat dissipating property, and can be widely used in LED illumination, electrics and electronics, communications, vehicles, electrical appliances and other fields requiring good heat conduction property and good heat dissipating property.

Description

Technical field [0001] The invention relates to a high and low temperature resistant PBT heat conduction material and a preparation method thereof. Background technique [0002] Traditional metal materials are widely used as thermal conductive materials in the fields of heat exchange engineering, electrical and electronic, LED lighting, etc. However, in recent years, thermally conductive polymer materials have attracted great attention in the industry and have developed rapidly, especially in the field of LED lighting. The potential to replace aluminum heat dissipation materials. The thermally conductive polymer materials currently appearing on the market mainly consist of filling and modifying polymer materials with thermally conductive fillers with good thermal conductivity, such as aluminum powder and alumina, so as to give the polymer materials with poor thermal conductivity a good Heat conduction performance. Among these materials, the commonly used matrix resins are mainl...

AI Technical Summary

Problems solved by technology

Among such materials, the commonly used matrix resins are mainly nylon (PA) and polyphenylene ether (PPS), polycarbonate (PC), liquid crystal polymer (LCP), etc., but the price is relatively high.

In addition, the filling amount of thermally conductive filler is relatively high, but too high filling amount often leads to serious brittleness of the material, which is manifested as a sharp drop in impact toughness, especially low temperature impact toughness is very poor, which cannot meet the requirements of practical applications

In the patent CN101899209A, thermally conductive fillers with different length-to-diameter ratios are compounded, and mineral fibers are added during the second pass to make up for the loss of material properties caused by high powder filling, but the impact toughness of the material is still poor

Patent CN101875760A introduces a high-impedance and high-thermal-conduction PBT composite material, but its heat-conducting powder is only limited to metal nitride aluminum nitride, and the price is expensive

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