Multistage focusing device and method

A focus plane and preset position technology, applied in optics, optomechanical equipment, instruments, etc., can solve the problems that the focusing device cannot meet the printed circuit board, time-consuming, laborious, and costly, and achieve a compact and applicable design structure. The effect of widening the range and increasing the focusing range

Inactive Publication Date: 2016-02-17
TIANJIN JINXIN MICROELECTRONICS TECH CO LTD
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Problems solved by technology

[0003] At present, the focusing device of the laser imaging system cannot meet the requirements of the printed circuit board (PCB) products with a plate thickness of 0.025mm-5mm on the market.
When processing PCB products with different thicknesses, it is necessary to add a suction cup backing plate to reach the position of the exposure focal plane, which is time-consuming, labor-intensive, and expensive.

Method used

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  • Multistage focusing device and method

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Embodiment Construction

[0029] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0030] A laser imaging system in Laser Dynamic Imaging (LDI) generally includes a laser, a focusing device, an image plane, and a lens barrel for placing a lens assembly. When LDI technology is applied to the processing of circuit boards, the printed circuit board coated with photoresist can be used as the image plane, and the exposure focal plane of the laser beam emitted by the laser can be located at different positions through the focusing device. Board-thic...

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Abstract

The invention provides a multistage focusing device and method and belongs to the technical field of laser direct imaging. The multistage focusing device is applied to a laser imaging system. The multistage focusing device comprises a wedge-shaped prism module, an echelon prism, a first power mechanism and a second power mechanism for driving the wedge-shaped prism module. The wedge-shaped prism module comprises a first prism module and a second prism module. The first power mechanism is used for driving the echelon prism to move so that the focal plane of a laser beam is located at a first preset position. The second power mechanism is used for driving the first prism module and the second prism module to move oppositely so as to adjust the focal plane of the laser beam from the first preset position to a second preset position, wherein the second preset position coincides with the image plane of the laser imaging system. The rough adjustment and fine adjustment of the focal plane position of the laser imaging system are achieved, the focusing range is increased on the basis of guaranteeing focal plane position control accuracy, and the market demand is satisfied effectively.

Description

technical field [0001] The invention relates to the technical field of laser direct imaging, in particular to a multi-stage focusing device and method. Background technique [0002] Laser direct imaging lithography technology combines high-power laser fiber coupling technology and image scanning technology based on digital micromirror devices, and is an advanced laser dynamic imaging technology (Laser Dynamic Imaging, LDI). LDI directly uses the data output by the CAM workstation to drive the laser imaging system, and uses the printed circuit board coated with photoresist as the image surface to transfer the preset graphics to the image surface. [0003] At present, the focusing device of the laser imaging system cannot satisfy the printed circuit board (Printed Circuit Board, PCB) products with a plate thickness of 0.025mm-5mm on the market. When processing PCB products with different thicknesses, it is necessary to add a suction cup backing plate to reach the position of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/207
CPCG03F7/7015
Inventor 王维娟刘涛马强
Owner TIANJIN JINXIN MICROELECTRONICS TECH CO LTD
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