Multistage focusing device and method

Abstract

The invention provides a multistage focusing device and method and belongs to the technical field of laser direct imaging. The multistage focusing device is applied to a laser imaging system. The multistage focusing device comprises a wedge-shaped prism module, an echelon prism, a first power mechanism and a second power mechanism for driving the wedge-shaped prism module. The wedge-shaped prism module comprises a first prism module and a second prism module. The first power mechanism is used for driving the echelon prism to move so that the focal plane of a laser beam is located at a first preset position. The second power mechanism is used for driving the first prism module and the second prism module to move oppositely so as to adjust the focal plane of the laser beam from the first preset position to a second preset position, wherein the second preset position coincides with the image plane of the laser imaging system. The rough adjustment and fine adjustment of the focal plane position of the laser imaging system are achieved, the focusing range is increased on the basis of guaranteeing focal plane position control accuracy, and the market demand is satisfied effectively.

Description

technical field [0001] The invention relates to the technical field of laser direct imaging, in particular to a multi-stage focusing device and method. Background technique [0002] Laser direct imaging lithography technology combines high-power laser fiber coupling technology and image scanning technology based on digital micromirror devices, and is an advanced laser dynamic imaging technology (Laser Dynamic Imaging, LDI). LDI directly uses the data output by the CAM workstation to drive the laser imaging system, and uses the printed circuit board coated with photoresist as the image surface to transfer the preset graphics to the image surface. [0003] At present, the focusing device of the laser imaging system cannot satisfy the printed circuit board (Printed Circuit Board, PCB) products with a plate thickness of 0.025mm-5mm on the market. When processing PCB products with different thicknesses, it is necessary to add a suction cup backing plate to reach the position of ...

AI Technical Summary

Problems solved by technology

[0003] At present, the focusing device of the laser imaging system cannot meet the requirements of the printed circuit board (PCB) products with a plate thickness of 0.025mm-5mm on the market.

When processing PCB products with different thicknesses, it is necessary to add a suction cup backing plate to reach the position of the exposure focal plane, which is time-consuming, labor-intensive, and expensive.

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