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SRAM memory cell, SRAM memory and control method thereof

A technology of storage cells and storage nodes, applied in static memory, digital memory information, information storage, etc., can solve the problem of small read current, difficult to avoid read access failure, dual-port SRAM write noise tolerance read static noise Tolerance tolerance and other issues, to improve the mismatch rate, improve readout current and static noise tolerance, and avoid uneven effects

Active Publication Date: 2016-02-17
SEMICON MFG INT (SHANGHAI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] With the continuous shrinking of memory size, the yield of DP-SRAM is facing more challenges, because with the decrease of input voltage (VDD) and the increase of transistor mismatch rate, the write noise margin (WNM) and Read Static Noise Margin (RSNM) gets worse and worse
In addition, due to the continuous shrinking of the device size, the read current Iread is also reduced, making it difficult to avoid the problem of read access failure caused by the defect of the bit line swing.

Method used

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  • SRAM memory cell, SRAM memory and control method thereof
  • SRAM memory cell, SRAM memory and control method thereof
  • SRAM memory cell, SRAM memory and control method thereof

Examples

Experimental program
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Embodiment 1

[0065] Below, refer to Figure 2A-2B The layout structure of the dual-port SRAM storage unit of the embodiment of the present invention will be described.

[0066] The dual-port SRAM storage unit of Embodiment 1 of the present invention, such as Figure 2A As shown, the SRAM memory cell includes: a first bit line BLA, a first supplementary bit line BLA1, a second bit line BLB, a second supplementary bit line BLB1, a first word line WLA, a second word line WLB, a first upper Pull-up transistor PU1, second pull-up transistor PU2, first parallel pull-down transistor group, second parallel pull-down transistor group, first pass transistor PG1, second pass transistor PG2, third pass transistor PG3, and fourth pass transistor PG4. Wherein, the first parallel pull-down transistor group is composed of a first pull-down transistor PD1_L and a second pull-down transistor PD1_R connected in parallel. The second parallel pull-down transistor group is composed of a third pull-down transi...

Embodiment 2

[0086] The present invention also provides an SRAM memory, the SRAM memory includes the SRAM storage unit described in Embodiment 1, wherein the memory may include several SRAM storage units, wherein the SRAM storage unit may be arranged along a row oriented or otherwise arranged.

[0087] The present invention also provides a control method of the SRAM memory, the control method comprising:

[0088] When performing a write operation on a selected one of the memory cells, the write word line corresponding to the selected one is set to a high potential, and the information transmitted by the peripheral circuit to the bit line pair is used as input; and

[0089] When performing a read operation on a selected one of the plurality of memory cells, the read word line corresponding to the selected one is set to a low potential, the read bit line is set to a high potential, and the unselected one is set to a high potential. The read word line corresponding to one of them is set to a...

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Abstract

The invention provides an SRAM memory cell, an SRAM memory and a control method thereof. The memory cell comprises a first pull-up transistor and a first parallel pull-down transistor, a first inverter is formed by connecting the first pull-up transistor and the first parallel pull-down transistor together, wherein the first parallel pull-down transistor is formed by connecting a first pull-down transistor and a second pull-down transistor in parallel; a second inverter is formed by connecting the second pull-up transistor and the second parallel pull-down transistor as well as connecting the second pull-up transistor and the second parallel pull-down transistor together, wherein the second parallel pull-down transistor is formed by a third pull-down transistor and a fourth pull-down transistor in parallel; and the first inverter and the second inverter are performed by cross coupling. According to the memory cell, control capability during a production process is enhanced, read-out current and static state noise tolerance of a dual-port SRAM unit can be increased, the mismatch ratio of the memory cell is improved, and the performance and yield rate of the SRAM memory cell can be increased.

Description

technical field [0001] The invention relates to the technical field of integrated circuits, in particular to an SRAM storage unit, an SRAM memory with the SRAM storage unit and a control method for the SRAM memory. Background technique [0002] With the continuous development of digital integrated circuits, on-chip integrated memory has become an important part of digital systems. Static Random Access Memory (Static Random Access Memory, referred to as SRAM) has become an indispensable and important part of on-chip memory due to its advantages of low power consumption and high speed. SRAM can hold data as long as it is powered, there is no need to constantly refresh it. [0003] Compared with single-port SRAM (Single-portSRAM, SP-SRAM for short) which has only one port for read and write operations, dual-port SRAM (Dual-portSRAM, DP-SRAM for short) has two ports, and each port can perform Read or write operations increase memory bandwidth. Therefore, DP-SRAM is widely use...

Claims

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Application Information

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IPC IPC(8): G11C11/413
Inventor 王颖倩王楠李煜王媛
Owner SEMICON MFG INT (SHANGHAI) CORP
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