Preparation method of flexible semiconductor device

Abstract

The invention belongs to the field of semiconductor manufacture, and discloses a preparation method of a flexible semiconductor device. The method includes: firstly, an inorganic semiconductor film is grown on an inorganic semiconductor substrate, then a semiconductor device based on the inorganic semiconductor film and an isolation medium layer are prepared, a groove is then etched so that the bottom of the semiconductor device maintains suspended, and finally the semiconductor device is transferred to a flexible substrate via a PDMS seal technology. The method is completely compatible with the current mainstream microelectronics technology, and the performance of the device can be effectively guaranteed via the semiconductor device prepared based on inorganic semiconductor materials; besides, the method can be widely applied to the preparation of flexible semiconductor devices of different kinds, such as light emitting diodes (LED) or field effect transistors (FET), the method can even be directly applied to the realization of flexible circuits, batch production of flexible circuit chips can be realized via the integration of the flexible packaging process, and the application values are very important.

Description

Technical field [0001] The invention belongs to the technical field of semiconductor manufacturing and relates to a method for preparing a flexible semiconductor device. Background technique [0002] In recent years, with the rapid development of flexible display technology and smart wearable products, flexible electronics has received more and more attention, and flexible semiconductor devices as the core components of flexible electronics have also received more and more extensive exploration and research . Organic semiconductor materials have always been the basic materials for the research of flexible semiconductor devices because of their better flexibility and lower process costs, such as organic light-emitting diodes (OLED), organic thin film transistors (OTFT), etc., but organic semiconductor materials are relatively low The carrier mobility greatly limits the improvement of device performance. At the same time, organic semiconductor materials are also extremely suscepti...

AI Technical Summary

Problems solved by technology

However, due to limited process conditions and manufacturing capabilities, the manufacturing cost of flexible semiconductor devices is high and the output is low. In order to obtain large-scale practical applications of flexible semiconductor devices, it is necessary to develop low-cost mass production process technology.

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