Radiator

Abstract

The invention relates to the technical field of heat dissipation devices of a microprocessor chip or an LED, and especially relates to a radiator. The radiator comprises a radiation fan, a micro-channel outer wall, radiation fins, a transmission cylinder, an isolation sleeve, a middle shaft, a transmission column, impellers, a high-pressure cavity upper cover, radiation heads, strong magnetic sheets and radiation micro-tubes. The radiator is characterized in that the fan drives the transmission cylinder to rotate, the transmission cylinder and the transmission column are isolated by the isolation sleeve, torque is transmitted by magnetic forces among the four high-temperature-resistance strong magnetic sheets, the transmission cylinder drives the impellers to rotate and the impellers are power sources of a fluid medium. The fluid medium flows through a high-pressure cavity, the upper radiation micro-tubes, the micro-channel radiation wall and the lower radiation micro-tubes in sequence and circulates in a radiation head low-pressure cavity. A switch triggering temperature is set through a temperature switch, and the radiation fan drives ambient air to flow quickly, so that heat transmission and heat convection respectively between the radiation fins and the ambient environment and between the micro-channel radiation wall and the ambient environment are strengthened. The radiator is compact in structure, low in energy consumption, small in size, high in heat dissipation amount, high in transportability and small in noise.

Description

technical field [0001] The invention relates to the technical field of cooling devices for microprocessor chips or LEDs, in particular to a radiator. Background technique [0002] With the increasing requirements for processors and the increasing power of LEDs, the integration of chips continues to increase, and the heat generated is increasing. If the generated heat cannot be dissipated in time, it may cause performance and reliability to decrease. Even permanently destroy the chip. Therefore, the problem of heat dissipation becomes more and more prominent. It has become one of several important factors restricting chip design. However, if the finished radiators on the market adopt the natural cooling method, the volume and structure are too large, and the heat dissipation effect is greatly affected by the ambient temperature and humidity. If the forced convection design is adopted, the cooling fan and the liquid pump are usually used to work separately. The liquid pump ...

AI Technical Summary

Problems solved by technology

At present, if the finished radiators on the market adopt the natural cooling method, the volume structure is too large, and the heat dissipation effect is greatly affected by the ambient temperature and humidity.

If the forced convection design is adopted, the cooling fan and the liquid pump are usually used to work separately, the liquid pump is noisy, the effect of the fan is not significant, and the energy consumption is increased, and the failure rate is also increased.

Therefore, most of the current radiators have disadvantages such as low efficiency, high energy consumption, bulky structure, poor portability, and high noise. In view of the above prominent problems, it is necessary to develop a new type of radiator

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