Circulating segmented type sand feeding device for electroplate diamond wire saw

Abstract

The invention discloses a circulating segmented type sand feeding device for an electroplate diamond wire saw. A metal wire base body is connected with the negative electrode of a direct current power source. A nickel plate is connected to the positive electrode of the direct current power source. A metal wire body is fixed to conducting wheels and is guided into a sand plating device through guide wheels, wherein the sand plating device is formed by indirectly connecting sand plating tanks and an electric-shielding insulating pipe. The outer edges of the sand plating tanks are engaged with a buffering belt. The buffering belt rotates under the control of gears. The lower portion of a sand blasting pipe is connected with a plating solution collecting tank through a precipitation groove. The bottom of the plating solution collecting tank is used for recycling plating solutions into the sand blasting pipe through a circulating recovery pipe. According to the circulating segmented type sand feeding device for the electroplate diamond wire saw, the sand feeding process of the part, at the sand plating tanks, of the metal wire base body is achieved, sand feeding cannot be conducted on the part, at the electric-shielding insulating pipe, of the metal wire base body due to the shielding action of a power line, so that segmentation of feeding is ensured; due to the cooperated function of the plating solution collecting tank and the sand blasting pipe, the sand collecting phenomenon is avoided, continuous sand blasting is achieved, high efficiency and evenness of sand feeding are ensured; and liquid is used cyclically, so that cost is saved, and efficiency is improved.

Description

technical field [0001] The invention belongs to the technical field of electroplating, and in particular relates to a circulating and segmented electroplating diamond wire saw sanding device. Background technique [0002] With the development of science and technology, the application of hard and brittle materials such as silicon crystals, sapphire, and ceramics is becoming more and more extensive. Most of the above materials are non-conductors or semiconductors, and generally have high hardness and high brittleness. Traditional cutting methods for hard and brittle materials often use cutting tools such as band saws and circular saws. When cutting, the kerf is wide and the yield is low, and it is easy to cause damage to the material during the cutting process and reduce the yield. The most widely used cutting tool today is the electroplated diamond wire saw. [0003] The electroplated diamond wire saw used today is continuously coated with diamond abrasive grains. When cut...

AI Technical Summary

Problems solved by technology

[0003] The electroplated diamond wire saw used today is continuously coated with diamond abrasive grains. When cutting with this kind of wire saw, there are the following problems: when cutting hard and brittle materials such as silicon crystals, due to the narrow kerf, the electroplated diamond wire saw itself The chip space is very limited, so that the cut chips are not easy to discharge and the cutting fluid is not easy to enter the kerf, resulting in low cutting efficiency

In the prior art, the sanding device cannot realize the continuous segmental sanding production of the electroplated diamond wire saw

When electroplating diamond wire, because the density of diamond is higher than that of the electroplating solution, it is easy to deposit a large amount in the upper sand tank, forming a collection of sand that cannot be recycled back to the mother tank, which not only causes difficulties in the circulation of the electroplating solution, but also causes uneven sanding before and after the diamond wire saw

In addition, when the traditional electroplating process is used to manufacture diamond saw wire, it is limited by the plating deposition speed, the saw wire manufacturing cycle is long, and the manufacturing cost is high, resulting in high production efficiency and production cost.

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