Preparation method of luminous adhesive

A technology of adhesives and phosphors, applied in the direction of adhesives, adhesive additives, epoxy resin glue, etc., can solve the problems of not being able to emit different brilliance, poor bonding performance, etc., and achieve strong bonding force, convenient curing, and high performance. Good results

CN105385397AActive Publication Date: 2016-03-09CENTRAL SOUTH UNIVERSITY OF FORESTRY AND TECHNOLOGY
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Publication Date
2016-03-09
Patent Text Reader

Abstract

The invention discloses a preparation method of a luminous adhesive. The preparation method comprises 1, taking epoxy resin, wherein when a room temperature is lower than 20 DEG C, the epoxy resin has large viscosity and is inconvenient for adhesive blending and homogenization and thus the epoxy resin needs to be heated in a water bath before use, 2, adding 50-120% of phosphor into the epoxy resin, carrying out stirring by a stirrer for 30min until the phosphor is completely dissolved in the epoxy resin, 3, adding 100% of 650 polyamide resin (as a plasticizer) into the epoxy resin mixture, carrying out stirring to obtain a uniform mixture, adding a proper amount of a filler into the mixture and carrying out stirring to obtain a uniform mixture, and 4, slowly adding an amine curing agent into the mixture and carrying out curing at a room temperature for 24h to obtain the luminous adhesive. The luminous adhesive has luminescence, water resistance, durability and good stability, can be realized easily, is convenient for operation, and has a low production cost.
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Description

technical field

[0001] The invention relates to a preparation method of an adhesive, in particular to a preparation method of a luminous adhesive. Background technique

[0002] Epoxy resin has good performance, strong bonding force, small shrinkage and convenient curing. Its shrinkage is small because the addition of epoxy resin to the curing agent does not produce by-products and does not produce bubbles, so the shrinkage rate is very small. Its strong adhesive force can be seen from the structure, because it contains three functional groups of hydroxyl group, ether group and epoxy group, which are extremely active bonds, and it is easy to form a certain force with the contact interface, so the adhesive force of epoxy resin is particularly strong . In addition, the curing of epoxy resin is very convenient. It uses various curing agents, and the epoxy resin system can be cured almost within the temperature range of 0-180°C.

[0003] Epoxy resins have good bonding propert...

Examples

Embodiment 1

[0016] Its preparation method consists of the following steps:

[0017] (1) get epoxy resin;

[0018] (2) Add phosphor powder accounting for 50% of the mass of epoxy resin into the epoxy resin, and stir in a mixer for 30 minutes until the phosphor powder is completely integrated into the epoxy resin to form an epoxy resin mixture;

[0019] (3) Add plasticizer 650 polyamide resin accounting for 100% of the quality of the epoxy resin mixture into the epoxy resin mixture and mix well; then add the filler glass fiber accounting for 20% of the quality of the epoxy resin mixture and mix well ;

[0020] (4) Finally, ethylenediamine, a curing agent accounting for 23% by mass of the epoxy resin mixture, was slowly added and cured at room temperature for 24 hours to obtain a luminous adhesive.

Embodiment 2

[0022] Its preparation method consists of the following steps:

[0023] (1) get epoxy resin;

[0024] (2) Add phosphor powder accounting for 60% of the mass of epoxy resin into the epoxy resin, and stir in a mixer for 35 minutes until the phosphor powder is completely incorporated into the epoxy resin to form an epoxy resin mixture;

[0025] (3) Add plasticizer 650 polyamide resin accounting for 100% of the quality of the epoxy resin mixture into the epoxy resin mixture and mix well; then add the filler glass fiber accounting for 25% of the quality of the epoxy resin mixture and mix well ;

[0026] (4) Finally, ethylenediamine, a curing agent accounting for 23% by mass of the epoxy resin mixture, was slowly added and cured at room temperature for 24 hours to obtain a luminous adhesive.

Embodiment 3

[0028] Its preparation method consists of the following steps:

[0029] (1) get epoxy resin;

[0030] (2) adding phosphor powder accounting for 70% of the mass of the epoxy resin into the epoxy resin, and stirring in a mixer for 40 minutes until the phosphor powder is completely incorporated into the epoxy resin to form an epoxy resin mixture;

[0031] (3) Add plasticizer 650 polyamide resin accounting for 100% of the quality of the epoxy resin mixture into the epoxy resin mixture and mix well; then add the filler glass fiber accounting for 25% of the quality of the epoxy resin mixture and mix well ;

[0032] (4) Finally, ethylenediamine, a curing agent accounting for 23% by mass of the epoxy resin mixture, was slowly added and cured at room temperature for 24 hours to obtain a luminous adhesive.