Preparation method for TiN/Ti composite permeable layer on surface of beryllium-copper alloy
A beryllium-copper alloy and composite infiltration technology, which is applied in metal material coating process, coating, solid-state diffusion coating and other directions, can solve the problems of insignificant improvement of wear resistance and limited increase in hardness of beryllium-copper alloy.
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Embodiment 1
[0034] The preparation method of the TiN / Ti compound infiltration layer on the beryllium-copper alloy surface provided by the present embodiment comprises the following steps:
[0035] (1) Pretreatment of the beryllium-copper alloy workpiece: the surface of the beryllium-copper alloy workpiece is polished with SiC water washing sandpaper → diamond powder polishing → acetone cleaning, and then dried for later use;
[0036] (2) Place the pretreated beryllium-copper alloy workpiece 4 on the cathode backing plate 5 in the plasma metallization furnace, and add an auxiliary cathode 2 around it, and process holes on the auxiliary cathode to facilitate the passage of working gas; The pure titanium plate 3 is placed above the beryllium-copper alloy workpiece through the target cathode frame 10, and the pure titanium plate 3 is located in the auxiliary cathode, with a distance of 18mm from the beryllium-copper alloy workpiece;
[0037] The target material is pure titanium plate with a p...
Embodiment 2
[0045] The preparation method of the TiN / Ti compound infiltration layer on the beryllium-copper alloy surface provided by the present embodiment comprises the following steps:
[0046] (1) Pretreatment of the beryllium-copper alloy workpiece: the surface of the beryllium-copper alloy workpiece is polished with SiC water washing sandpaper → diamond powder polishing → acetone cleaning, and then dried for later use;
[0047] (2) Place the pretreated beryllium-copper alloy workpiece 4 on the cathode backing plate 5 in the plasma metallization furnace, and add an auxiliary cathode 2 around it, and process holes on the auxiliary cathode to facilitate the passage of working gas; The pure titanium plate 3 is placed above the beryllium copper alloy workpiece through the target cathode frame 10, the pure titanium plate 3 is located in the auxiliary cathode, and the distance between the beryllium copper alloy workpiece and the beryllium copper alloy workpiece is 25mm;
[0048] (3) The be...
Embodiment 3
[0055] The preparation method of the TiN / Ti compound infiltration layer on the beryllium-copper alloy surface provided by the present embodiment comprises the following steps:
[0056] (1) Pretreatment of the beryllium-copper alloy workpiece: the surface of the beryllium-copper alloy workpiece is polished with SiC water washing sandpaper → diamond powder polishing → acetone cleaning, and then dried for later use;
[0057] (2) Place the pretreated beryllium-copper alloy workpiece 4 on the cathode backing plate 5 in the plasma metallization furnace, and add an auxiliary cathode 2 around it, and process holes on the auxiliary cathode to facilitate the passage of working gas; The pure titanium plate 3 is placed above the beryllium-copper alloy workpiece through the target cathode frame 10, and the pure titanium plate 3 is located in the auxiliary cathode, with a distance of 15mm from the beryllium-copper alloy workpiece;
[0058] (3) The beryllium copper alloy workpiece is connect...
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