Scratch detection method on raw silicon wafer surface based on machine vision

Abstract

The invention discloses a method for detecting scratches on the surface of raw silicon wafers based on machine vision, which belongs to the technical field of machine vision defect detection, and adopts image position correction technology, grayscale image segmentation technology, linear filtering technology, edge detection technology, data statistics and analysis technology, image processing technology, and morphological analysis to process and analyze the collected images; filter the image, initially extract the surface scratch information, further highlight the scratch position and size after binarization processing, and finally Primary scratches were screened out by morphological analysis and particle filtration methods. The invention can realize online stable and accurate judgment of the existence and directionality of scratches on the surface of raw silicon wafers, and display the detection results in real time; and can send signals to the PLC controller controlling the conveyor belt through the data acquisition module, so that it can correspond to different Categories Quickly control the conveyor belt to take different actions.

Description

technical field [0001] The invention belongs to the technical field of machine vision defect detection, and in particular relates to a method for detecting scratches on the surface of raw silicon wafers based on machine vision. Background technique [0002] Silicon wafer is the main raw material for solar cell production. Since it exists at the beginning of the entire cell production line, its quality directly determines the process quality of semi-finished products and even finished cells in all subsequent processes such as texturing, coating, and printing. , thereby affecting the performance of solar cells; and in the production process of raw materials for silicon wafers, scratches are sometimes formed on the surface of raw materials due to the shaking of cutting tools when slicing raw materials, so the surface of raw silicon wafers must be scratched Scratch detection, to remove defective silicon wafers with too many scratches. However, due to the texture of the surface ...

AI Technical Summary

Problems solved by technology

However, due to the texture of the surface of raw silicon wafers, the difference in gray scale, the insensitivity of light to scratches, the influence of external environmental noise and other factors, the detection of surface scratches has brought certain uncertainties.

[0003] At present, many solar cell manufacturers mainly use manual inspection to deal with this problem, which not only has high cost, but also brings a series of problems such as human factors cannot be ignored, there is no fixed standard, and it is easy to cause debris, etc., thus Reduce production efficiency, and ultimately it is difficult to meet the needs of highly automated modern factories

Images