High-performance silicon-based thermal-conducting gel and preparation method thereof

Abstract

The invention discloses high-performance silicon-based thermal-conducting gel and a preparation method thereof. The silicon-based thermal-conducting gel is prepared from organic silicone gel, hydrogen-containing silicone oil, hydroxyl silicone oil and thermal conductive powder, wherein the thermal conductive powder is prepared by polar matching of different kinds of powder according to large, medium and small particle sizes. The high-performance silicon-based thermal gel has excellent thixotropy, high thermal conductivity and good blocking property and is capable of replacing a thermal gel gasket; operation can be carried out by a dispensing machine in application; the production efficiency is greatly improved; a macromolecular structure in thermal conductive mud is connected into a mesh in the fabrication process; seepage of low molecular silicone oil is effectively blocked; and the high-performance silicon-based thermal gel has relatively high high-temperature resistance, is simple and feasible in preparation method, simple to operate in application, safe and reliable.

Description

technical field [0001] The invention belongs to a heat-interface organic silicon heat-conducting material, in particular to a high-performance silicon-based heat-conducting gel and a preparation method thereof. Background technique [0002] In the electrical and electronic field, due to the development of integration technology and micro-encapsulation technology, electronic components and electronic equipment are developing in the direction of miniaturization and miniaturization, resulting in more heat generated in a limited volume. At this time, high thermal conductivity insulation is required The material dissipates the heat generated quickly. Every 10°C reduction is of great significance to the normal use and service life of sensitive components. [0003] At present, silicon-containing thermal paste and heat-conducting silicon pads are mainly used in the market. During storage and use of silicon-containing thermal paste, silicone oil often precipitates, which makes i...

AI Technical Summary

Problems solved by technology

[0003] At present, the market is mainly based on silicon-containing thermal paste and heat-conducting silicon gaskets. During storage and use of silicon-containing thermal paste, silicone oil often precipitates, which makes it dry and greatly reduces thermal conductivity.

In the production process, the heat-conducting silicon gasket needs to be cut into the corresponding shape according to the requirements, and the gasket needs to be pasted to the corresponding position manually, which greatly reduces the production efficiency and use efficiency of the heat-conducting silicon gasket.

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