High-performance silicon-based thermal-conducting gel and preparation method thereof

A high-performance, silicone gel technology, applied in the field of thermal interface silicone thermal conductive materials, can solve the problems of reduced production efficiency and use efficiency of thermally conductive silicon gaskets, reduced thermal conductivity, and precipitation of silicone oil, to avoid high contact resistance, easy to use. The effect of low filling and volatilization weight loss

Inactive Publication Date: 2016-03-23
江苏晶河电子科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] At present, the market is mainly based on silicon-containing thermal paste and heat-conducting silicon gaskets. During storage and use of silicon-containing thermal paste, silicone oil often precipitates, which makes it dry and greatly reduces thermal conductivity.
In the production process, the heat-conducting silicon gasket needs to be cut into the corresponding shape according to the requirements, and the gasket needs to be pasted to the corresponding position manually, which greatly reduces the production efficiency and use efficiency of the heat-conducting silicon gasket.

Method used

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  • High-performance silicon-based thermal-conducting gel and preparation method thereof
  • High-performance silicon-based thermal-conducting gel and preparation method thereof

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preparation example Construction

[0043] A preparation method of silicon-based thermally conductive gel is: comprising the following steps:

[0044] (i) Thermally conductive powder drying

[0045] Bake the thermally conductive powder at 150°C for 20-40 hours to remove moisture;

[0046] (ii) The particle size of the thermally conductive powder is extremely matched

[0047] The particle size of the heat-conducting powder is perfectly matched, and the heat-conducting powder with three particle sizes of large, medium and small is selected according to the weight ratio of 5:3:1 for pre-mixing;

[0048] (iii) mix

[0049] Mix the thermally conductive powder obtained in step (ii) with silicone gel, hydrogen-containing silicone oil and hydroxyl silicone oil in a double planetary mixer for 20 to 30 minutes;

[0050] (iv) Vulcanization

[0051] The mixture obtained in step (iii) was baked at 120°C for 24 hours to fully cross-link, and then cooled to obtain a high-performance silicon-based thermally conductive gel. ...

Embodiment 1～3

[0053] (1) Raw material preparation

[0054] a. Silicone gel (two-component A and B, mixed in a ratio of 1:1.)

[0055] b. Methyl hydrogen silicone oil

[0056] c. Hydroxy silicone oil

[0057] d. Thermal powder

[0058] Among them: d1 aluminum powder (average particle size 3μm)

[0059] d2 alumina powder (average particle size 55μm)

[0060] d3 boron nitride powder (average particle size 25μm)

[0061] After the above-mentioned heat-conducting powder is dried, it is matched according to the ratio shown in Table 1.

[0062] (2) Put the above-mentioned components in proportion (see Table 1 for specific components and their proportions) into a double planetary mixer for mixing to obtain a silicon-based thermally conductive gel.

[0063] The composition of Examples 1-3 silicon-based thermally conductive gel is shown in Table 1 below:

[0064] Table 1

[0065]

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Abstract

The invention discloses high-performance silicon-based thermal-conducting gel and a preparation method thereof. The silicon-based thermal-conducting gel is prepared from organic silicone gel, hydrogen-containing silicone oil, hydroxyl silicone oil and thermal conductive powder, wherein the thermal conductive powder is prepared by polar matching of different kinds of powder according to large, medium and small particle sizes. The high-performance silicon-based thermal gel has excellent thixotropy, high thermal conductivity and good blocking property and is capable of replacing a thermal gel gasket; operation can be carried out by a dispensing machine in application; the production efficiency is greatly improved; a macromolecular structure in thermal conductive mud is connected into a mesh in the fabrication process; seepage of low molecular silicone oil is effectively blocked; and the high-performance silicon-based thermal gel has relatively high high-temperature resistance, is simple and feasible in preparation method, simple to operate in application, safe and reliable.

Description

technical field [0001] The invention belongs to a heat-interface organic silicon heat-conducting material, in particular to a high-performance silicon-based heat-conducting gel and a preparation method thereof. Background technique [0002] In the electrical and electronic field, due to the development of integration technology and micro-encapsulation technology, electronic components and electronic equipment are developing in the direction of miniaturization and miniaturization, resulting in more heat generated in a limited volume. At this time, high thermal conductivity insulation is required The material dissipates the heat generated quickly. Every 10°C reduction is of great significance to the normal use and service life of sensitive components. [0003] At present, silicon-containing thermal paste and heat-conducting silicon pads are mainly used in the market. During storage and use of silicon-containing thermal paste, silicone oil often precipitates, which makes i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/06C08L83/05C08K3/08C08K3/22C08K3/38
CPCC08L83/04C08L2205/025C08L2205/03C08L83/06C08K2003/0812C08K2003/2227C08K2003/385
Inventor 王晶
Owner 江苏晶河电子科技有限公司
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