Resin composition and presoaking material and laminated board using same

A resin composition and resin technology, applied in the field of prepreg, laminate, and resin composition, can solve problems such as adverse effects on dielectric properties, influence on prepregs, poor compatibility, etc., and achieve dielectric properties and peel strength. High, excellent appearance, the effect of improving dielectric properties

Active Publication Date: 2016-03-23
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the low polarity of polyphenylene ether resin, the compatibility with other resins in the resin composition is poor, which will affect the appearance of prepreg; in addition, the impregnation of polyphenylene ether resin and glass fiber cloth is not ideal , it is easy to gather into a film on the surface of the glass cloth, which will also affect the appearance of the prepreg, and then have an adverse effect on the dielectric properties of the product
[0004] The patent with publication number CN1556830 proposes a method of functionalizing polyphenylene ether, that is, reacting polyphenylene ether with bisphenol A epoxy resin under the action of an amine catalyst, and obtaining two end groups with two rings respectively. The polyphenylene ether / epoxy resin prepolymer of oxygen group, this method has improved the above-mentioned application problem of polyphenylene ether to a certain extent, but the bisphenol A type epoxy resin that introduces is to resin molecule The dielectric properties of the material are adversely affected - increasing its Dk / Df

Method used

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  • Resin composition and presoaking material and laminated board using same
  • Resin composition and presoaking material and laminated board using same
  • Resin composition and presoaking material and laminated board using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0097] (1) Preparation of prepolymer solution of epoxy resin modified polyphenylene ether resin:

[0098] Dissolve 50 parts of bisphenol A epoxy resin and 0.005 part of pyridine under heating and stirring; then dissolve 50 parts of solid polyphenylene ether resin in xylene solvent to make polyphenylene ether resin with a solid content of 30-70%. The ether resin solution was slowly added dropwise into the above epoxy resin melt, and after the dropwise addition was completed, it was stirred and reacted at 145° C. for 6 hours to obtain a prepolymer solution of epoxy resin modified polyphenylene ether resin. The GPC charts of the prepolymer products of epoxy resin, polyphenylene ether and epoxy resin modified polyphenylene ether resin are as follows: figure 1 , figure 2 and image 3 shown.

[0099] (2) Preparation of prepolymer composition of epoxy resin modified polyphenylene ether resin

[0100] With the prepolymer of step (1) epoxy resin modified polyphenylene ether resin ...

Embodiment 2

[0104] (1) Preparation of prepolymer solution of epoxy resin modified polyphenylene ether resin:

[0105] Dissolve 50 parts of DCPD epoxy resin and 0.005 parts of pyridine under heating and stirring; then dissolve 50 parts of solid polyphenylene ether resin in xylene solvent to make a polyphenylene ether resin solution with a solid content of 30-70%. , slowly added dropwise into the above epoxy resin melt, after the dropwise addition was completed, stirred and reacted at 145° C. for 6 hours to obtain a prepolymer solution of epoxy resin-modified polyphenylene ether resin. The weight average molecular weight was 6,200 in the molecular weight measurement by GPC of the prepolymer of the obtained epoxy resin-modified polyphenylene ether resin.

[0106] (2) Preparation of prepolymer composition of epoxy resin modified polyphenylene ether resin

[0107] With 60 parts by weight of step (1) prepolymer of epoxy resin modified polyphenylene ether resin, 20 parts by weight of phenol nov...

Embodiment 3

[0111] (1) Preparation of prepolymer solution of epoxy resin modified polyphenylene ether resin:

[0112] Dissolve 20 parts of DCPD epoxy resin and 0.005 part of pyridine under heating and stirring; then dissolve 50 parts of solid polyphenylene ether resin in toluene solvent to make a polyphenylene ether resin solution with a solid content of 30-70%. Slowly added dropwise to the above epoxy resin melt, and after the dropwise addition was completed, stirred and reacted at 145°C for 6 hours to obtain a prepolymer solution of epoxy resin modified polyphenylene ether resin. The weight average molecular weight was 6,200 in the molecular weight measurement by GPC of the prepolymer of the obtained epoxy resin-modified polyphenylene ether resin.

[0113] (2) Preparation of prepolymer composition of epoxy resin modified polyphenylene ether resin

[0114] With 60 parts by weight of step (1) prepolymer of epoxy resin modified polyphenylene ether resin, 20 parts by weight of phenol novol...

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Abstract

The invention provides a resin composition and a presoaking material and laminated board using the same. The resin composition comprises a prepolymer of epoxy-resin-modified polyphenylene oxide resin and benzoxazine resin. According to the resin composition and the presoaking material and laminated board using the same, the prepolymer of the epoxy-resin-modified polyphenylene oxide resin is used for the resin composition of a printed circuit board, the dielectric property of a copper-clad plate can be improved, the wettability of glass fibre cloth made of the resin composition containing the prepolymer of the epoxy-resin-modified polyphenylene oxide resin can be improved, and the obtained resin composition can have excellent appearance, heat resistance, dielectric property and peeling strength.

Description

technical field [0001] The invention belongs to the technical field of copper-clad laminates, and in particular relates to a resin composition and a prepreg and a laminated board using the resin composition. Background technique [0002] Polyphenylene ether resin has excellent water resistance, dimensional stability, flame retardancy and dielectric properties, and can be mixed with other resins to obtain a resin composition with more excellent comprehensive properties. Therefore, it is widely used as a raw material in various fields, such as plumbing fixtures, electrical boxes, automobile parts, and coated wires, copper foil laminates and printed circuits, etc. [0003] Although the copper foil laminate based on polyphenylene ether resin can obtain excellent dielectric properties, in the application of the prior art, only the simple physical blending of polyphenylene ether resin and other resin compositions is used to form a uniform glue varnish, which is impregnated in The...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L87/00C08L61/08C08L79/04C08K3/36C08G81/00B32B15/08B32B15/098B32B15/20B32B17/04B32B27/04B32B27/28B32B27/42B32B37/06B32B37/10B32B37/15
CPCB32B15/08B32B15/098B32B15/20B32B17/04B32B27/04B32B27/28B32B27/42B32B37/06C08K3/36C08L79/04C08L87/00B32B37/10B32B37/15B32B2250/40B32B2260/021B32B2260/046B32B2262/101B32B2270/00B32B2307/20B32B2307/306B32B2307/3065B32B2457/08C08G81/00C08L2201/02C08L2201/08C08L2203/20C08L2205/03C08L61/06
Inventor 周应先何岳山
Owner GUANGDONG SHENGYI SCI TECH
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