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Mems resonant pressure sensor and its manufacturing process

A pressure sensor and manufacturing process technology, applied in the field of sensors, can solve the problems of increasing chip area, complex process, difficult control, etc., achieve the effects of high device accuracy and consistency, reduce process difficulty, and simple integration process

Active Publication Date: 2018-05-25
CHINA RESOURCES MICROELECTRONICS (CHONGQING) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the existing resonant pressure sensor manufacturing process, the manufacturing process of the core part, the resonator and the pressure sensitive film are very complicated and difficult to control
In addition, the traditional process usually prepares the excitation metal electrode and the detection metal electrode on the upper plate plane, and forms an electrostatic excitation and capacitive pickup structure with the resonator; then through glass paste bonding (using the glass paste Insulation properties) lead the excitation metal electrode and detection metal electrode leads to the outside of the bonded chip. Since the glass paste generally adopts a screen printing process, its thickness is difficult to control, which not only complicates the entire process, but also increases the chip area. thereby reducing the applicability of the process

Method used

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  • Mems resonant pressure sensor and its manufacturing process
  • Mems resonant pressure sensor and its manufacturing process
  • Mems resonant pressure sensor and its manufacturing process

Examples

Experimental program
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Effect test

Embodiment 1

[0072] This embodiment provides a MEMS resonant pressure sensor manufacturing process, which mainly includes the following steps:

[0073] Step S100: Provide an upper pole plate, a first groove is formed in the upper pole plate, and several pairs of through holes are provided at the bottom of the groove, each pair of through holes runs through the front to the back of the upper pole plate, and the upper pole plate Both the front and back sides are provided with a number of spaced apart metal electrodes, and any pair of through holes are set between a group of two metal electrodes overlapping in the vertical direction on the front and back sides of the upper plate;

[0074] Step S200: providing a silicon sensitive structure with a resonant cavity;

[0075] Step S300: providing a lower pole plate, the lower pole plate is formed with a second groove, and a pressure guiding hole is arranged at the bottom of the second groove, and the pressure guiding hole runs through the front si...

Embodiment 2

[0108] This embodiment provides a MEMS resonant pressure sensor. The MEMS resonant pressure sensor includes: an upper plate 100, a first groove 150 is formed in the upper plate 100, and several pairs of through holes are arranged at the bottom of the first groove 150. Each pair of through holes runs through the front to the back of the upper pole plate 100, and the front and back sides of the upper pole plate 100 are provided with a number of spaced apart metal electrodes, and any pair of through holes are all arranged on the front side of the upper pole plate 100 Between a group of two metal electrodes overlapping in the vertical direction on the opposite sides; a silicon sensitive structure with a resonant cavity 230'; the lower pole plate 300, the lower pole plate 300 is formed with a second groove 302, the second groove A pressure guide hole 304 is provided at the bottom of the groove 302, and the pressure guide hole 304 runs through the front to the back of the lower plate...

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Abstract

The invention provides a MEMS resonant pressure sensor manufacturing process. The resonator in the invention uses silicon-silicon bonding to realize the preparation of the resonant blade and the pressure sensitive film, and the upper plate adopts a silicon perforated structure to realize electrostatic excitation and capacitive vibration pickup At the same time, the eutectic bonding method is adopted between the resonator and the upper plate, which not only reduces the difficulty of the process, reduces the chip area, but also the eutectic bonding integration process between the resonator and the upper plate is simpler and less Screen printing equipment that requires glass paste coating, and makes devices more precise and consistent.

Description

technical field [0001] The invention relates to the field of sensors, specifically, to a MEMS resonant pressure sensor and a manufacturing process. Background technique [0002] Micropressure Sensor (Micropressure Sensor) is a kind of microsensor. It is the earliest micromechanical product developed, and also the most mature and earliest industrialized product in micromechanical technology. Its principle is a device that converts pressure (measured) into electrical signal (such as voltage, current) output. The most common micro pressure sensors are piezoresistive, capacitive, and resonant. [0003] The silicon micro-resonant pressure sensor based on MEMS (Micro-electromechanical Systems) technology is currently the most accurate silicon micro-pressure sensor. It indirectly measures the pressure by detecting the natural frequency of the object and outputs a quasi-digital signal. Its accuracy is mainly affected by the mechanical characteristics of the structure, so it has st...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01L1/14B81B7/00B81C1/00
Inventor 赵大国马清杰王赞
Owner CHINA RESOURCES MICROELECTRONICS (CHONGQING) CO LTD