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A low-power thermal insulation reinforcement process for lcd modules

A heat insulation and low power consumption technology, which is applied in the direction of instruments, nonlinear optics, optics, etc., can solve the problems of poor heat preservation effect, improve heating effect, reduce heating power consumption, reduce or block heat loss Effect

Active Publication Date: 2019-03-12
NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a low-power heat insulation and heat preservation reinforcement process for LCD modules to solve the problem of poor heat preservation effect in the existing optical composite bonding technology

Method used

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  • A low-power thermal insulation reinforcement process for lcd modules
  • A low-power thermal insulation reinforcement process for lcd modules

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] like figure 1 shown.

[0022] A low-power heat-insulation and heat-insulation reinforcement method for an LCD module. First, a heat-preservation groove is machined at each of the four corners of the metal front shell, and the inner surface of the heat-preservation groove is frosted to form a frosted surface; the heat-preservation groove is 15mm long, 5mm wide, and deep. 0.2mm, and secondly, prepare the aerogel composite thermal insulation felt, the aerogel composite thermal insulation felt is composed of a skeleton formed by overlapping glass fibers with a diameter of 3 μm, and the gap between the skeleton is uniformly filled with aerogel particles with a particle size of 100 nm. The thermal conductivity of the thermal insulation felt is 0.024W / m·K; thirdly, the aerogel composite thermal insulation felt and the thermal insulation tank are glued and bonded by the thermal insulation coating with hollow glass beads as the core.

Embodiment 2

[0024] like figure 2 shown.

[0025] A low-power heat-insulation and heat-insulation reinforcement method for an LCD module is realized by coating a transparent heat-insulation and heat-insulation optical compound adhesive 22 with a thickness of 0.2-0.3mm between the liquid crystal display screen 21 and the glass 23 . The transparent thermal insulation optical composite adhesive 22 is composed of nano-SiO 2 It is composed of aerogel slurry, water-based acrylate resin, dispersant, initiator and other fillers. The mass percentage of each component is: nano-SiO 2 Aerogel slurry 15%~25%, water-based acrylate resin 60%~75%, dispersant 2%~5%, initiator 1%~5%, other fillers 1%~3%, the sum of each component is 100%; the nano-SiO 2 The aerogel slurry mainly includes the mass fraction of 60%~80% ethyl orthosilicate silica sol, 5%~10% infrared sunscreen agent, and 5%~20% reinforcing fiber; the infrared sunscreen agent is based on alcohol. Indium tin oxide ITO nanoalcohol paste or IT...

Embodiment 3

[0028] refer to figure 1 , a low-power thermal insulation reinforcement method for LCD modules. First, a thermal insulation groove is processed at each of the four corners of the metal front shell, and the inner surface of the thermal insulation tank is frosted to form a frosted surface; the thermal insulation groove is 15mm long and 5mm wide. The depth is 0.2 mm, and secondly, an aerogel composite thermal insulation felt is prepared. The aerogel composite thermal insulation felt is made of a skeleton formed by overlapping glass fibers with a diameter of 3 μm, and the gap between the skeleton is uniformly filled with aerogel particles with a particle size of 95 nm. , the thermal conductivity of the thermal insulation blanket is 0.024W / m·K; thirdly, the aerogel composite thermal insulation blanket and the thermal insulation tank are glued and bonded by the thermal insulation coating with hollow glass microspheres as the core; A layer of transparent thermal insulation optical co...

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Abstract

A low-power heat insulation and heat preservation reinforcement process for an LCD module is characterized in that the purpose of partial heat preservation of the module is achieved through the joint action of the heat preservation groove on the front shell of the metal structure and the transparent heat insulation and heat preservation optical composite glue. The thermal insulation tank of the present invention is located at the four corners of the metal front shell, the inner surface of the tank is a frosted surface, and the thermal insulation material is pasted in the tank, and the thermal conductivity is less than 0.03W / m·K; the transparent thermal insulation optical composite adhesive is Made of nano-SiO2 airgel slurry, water-based acrylate resin, dispersant, initiator and other fillers, its thermal conductivity is less than 0.09W / m·K, and its light transmittance is greater than 97%; This process can improve the display quality of the module at low temperature, reduce power consumption at low temperature, and reduce the occurrence rate of low temperature failure.

Description

technical field [0001] The invention relates to a liquid crystal display technology, in particular to a technology for strengthening a liquid crystal display in a low temperature state, in particular to a low power consumption heat insulation and heat preservation strengthening technology for an LCD module. Background technique [0002] Thin Film Transistor Liquid Crystal Displays (TFT-LCDs) require the ability to display at extremely low temperatures in some special cases. The existing technology mainly widens the lower temperature limit of low temperature operation by installing a convenient and reliable heating system, and mostly adopts the ITO transparent heating sheet technology and the co-heating technology of the front screen glass and the rear heating film. At present, the general heating film is a light-transmitting, thermally conductive and conductive material with a certain resistivity. ITO is coated on the transparent heating film and then closely attached to the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/1333G02F1/13
CPCG02F1/1303G02F1/133382
Inventor 王璐王绪丰樊卫华杨斌吴金华李忠良张小芸徐飞
Owner NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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