Preparation method of interface heat conduction material silicone rubber pad

Abstract

The invention discloses a preparation method of an interface heat conduction material silicone rubber pad. The method comprises steps as follows: (1) adding 10-300 parts of inorganic heat conduction powder by weight, 1-10 parts of a catalyst by weight and 1-10 parts of a mixture of dimethicone and hydrogen-containing silicone oil by weight to 100 parts of silicone rubber by weight, and evenly kneading the mixture to obtain a rubber compound; (2) taking 10-90 parts of a carbon material adopting a 3D network structure by weight, and filling the carbon material with the rubber compound obtained in step (1) to obtain a composite material; (3) vulcanizing the composite material to obtain a finished product, namely, the silicone rubber pad. With the adoption of the method, the carbon material with the ultrahigh heat-conducting property can be arranged directionally in the silicone rubber to form the regular directional heat conduction network structure, so that the product with the ultrahigh heat conductivity is obtained.

Description

Technical field [0001] The invention relates to the field of thermally conductive polymer composite materials, in particular to a method for preparing an interface thermally conductive material silicone rubber pad with ultra-high thermal conductivity. Background technique [0002] With the rapid development of microelectronics integration technology and high-density printed circuit board assembly technology, microelectronics devices are now gradually developing in the direction of miniaturization and convenience. Driven by high power, the working thermal environment of semiconductors moves rapidly to high temperatures, which requires that the heat generated by the semiconductors can be conducted at a high speed to ensure the normal operation of electronic equipment. With the development of electronic equipment in the direction of high power and miniaturization, the requirements for thermal conductivity of thermally conductive gap fillers are getting higher and higher. It can even...

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Problems solved by technology

This patent uses a mixture of expanded graphite and other carbon materials as a filler to improve the thermal conductivity of the silicone rubber composite material. Although this method can increase the thermal conductivity of the silicone rubber composite material to 4W / m·K, it still cannot meet the high power requirements. Electronic equipment requires thermal conductivity of thermal gap filler materials, and its preparation process is very complicated, which is not conducive to industrial production

[0006] Another example is that the prior art with the Chinese patent number "201410554466.6" disclosed a graphene-containing silicone rubber heat-conducting composite material and its preparation method on February 4, 2015, although the heat-conducting silicone rubber material prepared by this method can reach The thermal conductivity of 4.98W / m K, but its pretreatment of the filler increases its production cost, and more importantly, it also fails to align graphene, which fails to reflect the ultra-high thermal conductivity of graphene itself. Advantages in silicone rubber

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