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Sheet for processing semiconductor

A technology for semiconductors and sheets used in the field of semiconductor processing sheets, which can solve the problems of polluting semiconductor wafers or chips, seepage, etc., and achieve sufficient antistatic properties and pollution suppression effects

Active Publication Date: 2016-04-13
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when a low-molecular-weight quaternary ammonium salt compound is used as an antistatic agent, there is a problem that the compound bleeds out from the adhesive sheet, or the residue (particles) of the adhesive agent contaminates the surface of an adherend such as a semiconductor wafer or chip.

Method used

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  • Sheet for processing semiconductor
  • Sheet for processing semiconductor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0135] (1) Preparation of acrylic polymer

[0136] Acrylic polymer (A1) was prepared by copolymerizing 90 parts by mass of n-butyl acrylate and 10 parts by mass of acrylic acid. When the molecular weight of this acrylic polymer (A1) was measured by the method mentioned later, it was 600,000 in weight average molecular weight. The obtained acrylic polymer (A1) was diluted with a mixed solvent of toluene and ethyl acetate to a solid content concentration of 34% by mass.

[0137] (2) Preparation of energy ray curable antistatic polymer (B)

[0138] [2-(methacryloyloxy) ethyl] trimethyl ammonium, bis (trifluoromethanesulfonyl) imine 45 parts by mass as quaternary ammonium salt monomer (B1), as reactive functional group-containing monomer ( 5 parts by mass of methacrylic acid in B2), 38 parts by mass of 2-ethylhexyl acrylate and 5 parts by mass of 2-hydroxyethyl acrylate as the polymerizable monomer (B3) were copolymerized. 7 parts by mass of glycidyl methacrylate as a curable g...

Embodiment 2

[0143] In the said process (3), except having changed the addition amount of the energy ray curable antistatic polymer (B) to 1.5 mass parts, it carried out similarly to Example 1, and manufactured the sheet|seat for semiconductor processing.

Embodiment 3

[0145] In the said process (3), except having changed the addition amount of the energy ray curable antistatic polymer (B) into 100 mass parts, it carried out similarly to Example 1, and manufactured the sheet|seat for semiconductor processing.

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Abstract

A sheet (1) for processing a semiconductor, provided with a substrate (2) and an adhesive layer (3) laminated on at least one surface of the substrate, wherein the adhesive layer (3) is formed from an adhesive composition containing: a polymer having a salt and an energy ray-curable base, and an energy ray-curable adhesive component (excluding the noted polymer). According to the sheet (1) for processing a semiconductor, it is possible to inhibit pollution of an adherend during peeling after energy ray irradiation while also demonstrating sufficient antistatic properties.

Description

technical field [0001] The present invention relates to a sheet for semiconductor processing. Background technique [0002] In the process of grinding and dicing a semiconductor wafer, an adhesive sheet is used for the purpose of fixing the semiconductor wafer or protecting circuits and the like. As such an adhesive sheet, there is an adhesive sheet that has a strong adhesive force in the processing process after being attached to the semiconductor wafer, and on the other hand, the adhesive force is lowered by the irradiation of energy rays when peeled off. permanent adhesive layer. [0003] Such an adhesive sheet is peeled off when the prescribed processing steps are completed, but at this time, a so-called Static electricity for stripping static electricity. Such static electricity causes breakdown of semiconductor wafers, chips, circuits forming them, and the like. In order to prevent this phenomenon, it is known that an adhesive sheet is provided with antistatic prop...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02C09J9/02C09J11/06C09J133/00H01L21/301H01L21/304
CPCC09J9/02H01L2221/68327H01L2221/68336H01L2221/6834H01L2221/68381H01L2221/68386C09J133/14C08L2312/06C08K5/0025C09J7/385H01L21/6836C09J2203/326C09J2301/408C09J2301/416C08K5/0075C09J2301/122C09J2301/302C09J2433/00C09J133/08C08L33/14C08L75/16
Inventor 山下茂之佐藤明德
Owner LINTEC CORP