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Sheets for semiconductor processing

A technology for semiconductors and sheets, applied in the field of sheet materials for semiconductor processing, can solve problems such as seepage and contamination of semiconductor wafers or chip surfaces, and achieve the effect of suppressing pollution and fully antistatic

Active Publication Date: 2020-11-10
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when a low-molecular-weight quaternary ammonium compound is used as an antistatic agent, the compound may bleed out from the adhesive sheet or cause residue (particles) of the adhesive to contaminate the surface of an adherend such as a semiconductor wafer or chip. The problem

Method used

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  • Sheets for semiconductor processing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0160] (1) Preparation of acrylic polymer

[0161] Acrylic polymer (A1) was prepared by copolymerizing 85 parts by mass of n-butyl acrylate and 15 parts by mass of 2-hydroxyethyl acrylate. When the molecular weight of this acrylic polymer (A1) was measured by the method mentioned later, it was 600,000 in weight average molecular weight. The solid content concentration of the obtained acrylic polymer (A1) was diluted to 34 mass % with the mixed solvent of toluene and ethyl acetate.

[0162] (2) Preparation of energy ray curable antistatic polymer (C)

[0163] [2-(methacryloyloxy)ethyl]trimethylammonium bis(trifluoromethanesulfonyl)imide as a quaternary ammonium salt monomer (C1), and a reactive functional group-containing monomer (C2) methacrylic acid, and 2-ethylhexyl acrylate and 2-hydroxyethyl acrylate as polymerizable monomers (C4) become quaternary ammonium salt monomer (C1): methacrylic acid (C2): acrylic acid in molar ratio 2-ethylhexyl ester (C4): 2-hydroxyethyl acry...

Embodiment 2

[0168] [2-(methacryloyloxy)ethyl]trimethylammonium bis(trifluoromethanesulfonyl)imide as a quaternary ammonium salt monomer (C1), and a reactive functional group-containing monomer (C2) Methacrylic acid, methoxypolyethylene glycol acrylate (repeating number of ethylene glycol units: 23) as an ether bond-containing monomer (C3), and 2-ethyl acrylic acid as a polymerizable monomer (C4) Hexyl ester and 2-hydroxyethyl acrylate to become quaternary ammonium salt monomer (C1): methacrylic acid (C2): ether bond monomer (C3): 2-ethylhexyl acrylate (C4): acrylic acid 2 -Hydroxyethyl ester (C4)=0.027:0.015:0.037:0.011:0.011 mode copolymerization. The obtained polymer was reacted with glycidyl methacrylate (0.012 in terms of molar ratio) as a curable group-containing compound (C5) to obtain an energy ray-curable antistatic polymer (C) ( It has methacryloyl, quaternary ammonium salt and ethylene glycol units in the side chain.). The molecular weight of this energy ray-curable antistatic...

Embodiment 3

[0171] An acrylic polymer was prepared by copolymerizing 85 parts by mass of n-butyl acrylate and 15 parts by mass of 2-hydroxyethyl acrylate. When the molecular weight of this acrylic polymer was measured by the method mentioned later, the weight average molecular weight was 500,000. The obtained acrylic polymer was reacted with methacryloyloxyethyl acrylate in an amount of 80 mol% of 2-hydroxyethyl acrylate to obtain an acrylic acid having an energy-ray-curable group introduced into the side chain. Polymer-like (A3).

[0172] Mix 100 parts by mass of the obtained acrylic copolymer (A3), 25 parts by mass of tetraethylene glycol diacrylate as the energy ray curable compound (B) containing an ether bond, and the energy ray curable compound obtained in Example 1. 16 parts by mass of antistatic polymer (C), 3.0 parts by mass of 1-hydroxycyclohexyl phenyl ketone (manufactured by BASF Corporation, Irgacure 184) as a photopolymerization initiator, and toluene diisocyanate compound ...

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Abstract

The semiconductor processing sheet (1) of the present invention includes a substrate (2) and an adhesive layer (3) laminated on at least one side of the substrate (2), wherein the adhesive layer (3) is composed of an adhesive composition Formed, the adhesive composition contains: a polymer having a salt and an energy ray curable group; and an energy ray curable adhesive component (other than the above-mentioned polymer), the adhesive composition will contain a structural unit having an ether bond A compound containing an energy ray-curable group as one component of an energy ray-curable adhesive component, or a structural unit having an ether bond as a side chain of a polymer. Such a semiconductor processing sheet (1) exhibits sufficient antistatic properties and suppresses contamination of an adherend when peeled off after irradiation with energy rays.

Description

technical field [0001] The present invention relates to a sheet for semiconductor processing. Background technique [0002] In the process of grinding and dicing a semiconductor wafer, an adhesive sheet is used for the purpose of fixing the semiconductor wafer or protecting circuits and the like. As such an adhesive sheet, there is an adhesive sheet which has a strong adhesive force in the processing step after the semiconductor wafer is attached, and on the other hand, has an energy ray which reduces the adhesive force by the irradiation of the energy ray at the time of peeling. Curable adhesive layer. [0003] These adhesive sheets are peeled off when the prescribed processing steps are completed, but at this time, a so-called Strips charged static electricity. Such static electricity causes destruction of semiconductor wafers, chips, circuits formed on the wafers and chips, and the like. In order to prevent this phenomenon, it is known that, in an adhesive sheet used ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683H01L21/67C09J7/20
CPCC09J7/20C09J11/04C09J133/00C09J171/02H01L21/67132H01L21/6836C09J2203/326C09J2301/312
Inventor 山下茂之
Owner LINTEC CORP
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