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Sheets for semiconductor processing

A technology for semiconductors and sheets, applied in the field of sheet materials for semiconductor processing, can solve the problems of contamination of semiconductor wafers or chips, seepage, etc., and achieve the effect of sufficient antistatic properties and inhibiting pollution

Active Publication Date: 2019-03-22
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when a low-molecular-weight quaternary ammonium salt compound is used as an antistatic agent, there is a problem that the compound bleeds out from the adhesive sheet, or the residue (particles) of the adhesive agent contaminates the surface of an adherend such as a semiconductor wafer or chip.

Method used

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  • Sheets for semiconductor processing
  • Sheets for semiconductor processing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0135] (1) Preparation of acrylic polymer

[0136] Acrylic polymer (A1) was prepared by copolymerizing 90 parts by mass of n-butyl acrylate and 10 parts by mass of acrylic acid. When the molecular weight of this acrylic polymer (A1) was measured by the method mentioned later, it was 600,000 in weight average molecular weight. The obtained acrylic polymer (A1) was diluted with a mixed solvent of toluene and ethyl acetate to a solid content concentration of 34% by mass.

[0137] (2) Preparation of energy ray curable antistatic polymer (B)

[0138] 45 parts by mass of [2-(methacryloyloxy) ethyl] trimethylammonium bis(trifluoromethanesulfonyl)imide as a quaternary ammonium salt monomer (B1), and 45 parts by mass as a reactive functional group-containing monomer (B2 ) and 5 parts by mass of methacrylic acid, 38 parts by mass of 2-ethylhexyl acrylate and 5 parts by mass of 2-hydroxyethyl acrylate as the polymerizable monomer (B3) were copolymerized. 7 parts by mass of glycidyl me...

Embodiment 2

[0143] In the said process (3), except having changed the addition amount of the energy ray curable antistatic polymer (B) to 1.5 mass parts, it carried out similarly to Example 1, and manufactured the sheet|seat for semiconductor processing.

Embodiment 3

[0145] In the said process (3), except having changed the addition amount of the energy ray curable antistatic polymer (B) into 100 mass parts, it carried out similarly to Example 1, and manufactured the sheet|seat for semiconductor processing.

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Abstract

The present invention provides a sheet for semiconductor processing. The semiconductor processing sheet (1) of the present invention includes a substrate (2) and an adhesive layer (3) laminated on at least one surface of the substrate, wherein the adhesive layer (3) is combined with an adhesive The adhesive composition contains: a polymer having a salt and an energy ray curable group, and an energy ray curable adhesive component other than the above-mentioned polymer. The sheet (1) for semiconductor processing exhibits sufficient antistatic properties and suppresses contamination of an adherend when peeled off after energy ray irradiation.

Description

technical field [0001] The present invention relates to a sheet for semiconductor processing. Background technique [0002] In the process of grinding and dicing a semiconductor wafer, an adhesive sheet is used for the purpose of fixing the semiconductor wafer or protecting circuits and the like. As such an adhesive sheet, there is an adhesive sheet that has a strong adhesive force in the processing process after being attached to the semiconductor wafer, and on the other hand, the adhesive force is lowered by the irradiation of energy rays when peeled off. permanent adhesive layer. [0003] Such an adhesive sheet is peeled off when the prescribed processing steps are completed, but at this time, a so-called Static electricity for stripping static electricity. Such static electricity causes breakdown of semiconductor wafers, chips, circuits forming them, and the like. In order to prevent this phenomenon, it is known that an adhesive sheet is provided with antistatic prop...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/24C09J9/02C09J11/06C09J133/00H01L21/301H01L21/304
CPCC09J9/02H01L2221/68327H01L2221/68336H01L2221/6834H01L2221/68381H01L2221/68386C09J133/14C08L2312/06C08K5/0025C09J7/385H01L21/6836C09J2203/326C09J2301/408C09J2301/416C08K5/0075C09J2301/122C09J2301/302C09J2433/00C09J133/08C08L33/14C08L75/16
Inventor 山下茂之佐藤明德
Owner LINTEC CORP
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