A method of integrating embedded heat dissipation microchannels in ltcc ceramic substrates

Abstract

The invention, which relates to the LTCC ceramic substrate technology, discloses a method for realizing integration of embedded heat-radiation micro channels in an LTCC ceramic substrate. The method comprises: step one, according to a structure demand of a heat-radiation micro channel, an LTCC raw ceramic plate is divided into N groups and interconnected through hole and circuit pattern manufacturing are carried out on each LTCC raw ceramic plate group; step two, according a grouping situation, lamination and pre compaction are carried out respectively to obtain N sub modules; step three, positioning hole and structures needed by micro channels are processed on the sub modules, the processed sub modules are pasted by using adhesives and then lamination is carried out under a low pressure, thereby forming an integrated raw ceramic block, wherein the low pressure is 2 to 50 psi; and then the raw ceramic block is sintered and cut, thereby obtaining an integrated-heat-radiation LTCC ceramic substrate with the integrated embedded micro channels. According to the invention, no sacrificial filling agent is required. Processes of pre compaction, pasting, and low-pressure lamination are carried out successfully, so that pressures on the micro channels are low and deformation can be prevented.

Description

technical field [0001] The invention relates to the technical field of microelectronic integration, in particular to a method for integrating embedded heat dissipation microchannels in an LTCC ceramic substrate, and the method is used for the packaging of high-power microwave integrated circuits. Background technique [0002] LTCC has outstanding advantages such as high integration density, microwave / digital / control multifunctional coordinated wiring, and excellent high-frequency performance, and has gradually become the first choice for circuit modules such as miniaturization, high-performance T / R components, frequency sources, and phased array antennas. . Determined by its own material characteristics (ceramics as the main crystal phase and 30-50% vol of low thermal conductivity glass), the thermal conductivity of LTCC is only 2-3 W / m.K, which cannot meet the packaging requirements of high-power microwave integrated circuits. need. [0003] In order to solve this problem...

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