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A method of integrating embedded heat dissipation microchannels in ltcc ceramic substrates

A ceramic substrate and micro-channel technology, applied in electrical components, electrical solid devices, circuits, etc., can solve problems such as micro-channel deformation, achieve high production qualification rate, meet inter-layer interconnection and reliability requirements, and eliminate co-firing Effects of matching puzzles

Active Publication Date: 2018-05-25
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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  • Claims
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Problems solved by technology

[0009] Aiming at the technical problem that the embedded heat dissipation microchannels in the prior art are difficult to avoid deformation and collapse of microchannels while ensuring reliable bonding between layers, the present invention discloses a method for integrating embedded heat dissipation microchannels in LTCC ceramic substrates. method

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  • A method of integrating embedded heat dissipation microchannels in ltcc ceramic substrates
  • A method of integrating embedded heat dissipation microchannels in ltcc ceramic substrates
  • A method of integrating embedded heat dissipation microchannels in ltcc ceramic substrates

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Embodiment Construction

[0028] The specific implementation manners of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0029] The following takes an LTCC ceramic substrate containing 12 layers of wiring as an example, and further describes it in conjunction with the accompanying drawings:

[0030] The adhesive used in the present invention, its main component is one of methyl methacrylate, ethyl methacrylate, polyvinyl butyral resin (PVB), polyvinyl chloride, etc., and its solvent is ethanol, acetone , butanone, butanol, toluene, trichlorethylene, cyclohexanone or one or more. For example: the main component is PVB, the solvent is butanone and butanol, and the weight ratio of the three is PVB: butanone: butanol = 5:90:5.

[0031] Such as figure 1 As shown, the LTCC ceramic substrate consists of a total of L 1 ~ L 12 There are 12 layers of green porcelain in total. In addition to specific alignment holes, interconnection holes and printed gra...

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Abstract

The invention, which relates to the LTCC ceramic substrate technology, discloses a method for realizing integration of embedded heat-radiation micro channels in an LTCC ceramic substrate. The method comprises: step one, according to a structure demand of a heat-radiation micro channel, an LTCC raw ceramic plate is divided into N groups and interconnected through hole and circuit pattern manufacturing are carried out on each LTCC raw ceramic plate group; step two, according a grouping situation, lamination and pre compaction are carried out respectively to obtain N sub modules; step three, positioning hole and structures needed by micro channels are processed on the sub modules, the processed sub modules are pasted by using adhesives and then lamination is carried out under a low pressure, thereby forming an integrated raw ceramic block, wherein the low pressure is 2 to 50 psi; and then the raw ceramic block is sintered and cut, thereby obtaining an integrated-heat-radiation LTCC ceramic substrate with the integrated embedded micro channels. According to the invention, no sacrificial filling agent is required. Processes of pre compaction, pasting, and low-pressure lamination are carried out successfully, so that pressures on the micro channels are low and deformation can be prevented.

Description

technical field [0001] The invention relates to the technical field of microelectronic integration, in particular to a method for integrating embedded heat dissipation microchannels in an LTCC ceramic substrate, and the method is used for the packaging of high-power microwave integrated circuits. Background technique [0002] LTCC has outstanding advantages such as high integration density, microwave / digital / control multifunctional coordinated wiring, and excellent high-frequency performance, and has gradually become the first choice for circuit modules such as miniaturization, high-performance T / R components, frequency sources, and phased array antennas. . Determined by its own material characteristics (ceramics as the main crystal phase and 30-50% vol of low thermal conductivity glass), the thermal conductivity of LTCC is only 2-3 W / m.K, which cannot meet the packaging requirements of high-power microwave integrated circuits. need. [0003] In order to solve this problem...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/367H01L23/473
Inventor 刘志辉岳帅旗张英华潘玉华梅永贵王小伟
Owner SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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