A kind of adhesive and its preparation method and application
A technology of adhesives and resins, applied in the direction of adhesives, bonding methods, adhesive additives, etc., can solve the problems of process simplification, failure to ensure good bonding force between inserts and injection molded parts at the same time, and achieve the effect of process simplification
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Embodiment 1
[0042] The formula of the adhesive S1 of the present embodiment is: Tg is 40% of thermoplastic polyurethane resin at 80°C; 18% of hydroxyl acrylic resin (hydroxyl value 110 KOHmg / g); 4% of MDI curing agent; silicon dioxide (average particle size diameter of 7 μm) 5%; additive (defoamer) 3%; diluent 30%, the foregoing content is the mass percentage.
[0043] Wherein, the diluent is a mixed system of xylene, methyl isobutyl ketone, ethylene glycol butyl ether, butyl acetate, cyclohexanone, and methyl ethyl ketone in a mass ratio of 5:5:1:1:5:1.
[0044] The production process is as follows: (1) Soak the thermoplastic polyurethane resin in the diluent for 8 hours, then heat it in an infrared oven at 60°C for 0.5 hours, and then stir it on a high-speed disperser at a speed of 1000r / min for 0.5 hours to obtain polyurethane solution; (2) Add hydroxyacrylic resin, MDI curing agent and auxiliary agent to the aforementioned polyurethane solution, and continue to stir at a speed of 1500...
Embodiment 2
[0046] The formula of the adhesive S2 of the present embodiment is: Tg is 30% of thermoplastic polyurethane resin of 80°C; 25% of hydroxyl acrylic resin (hydroxyl value 110 KOHmg / g); 6% of TDI curing agent; diameter of 3 μm) 6%; additive (leveling agent) 1%; diluent 32%, the above content is the mass percentage.
[0047] Wherein, the diluent is a mixed system of xylene, methyl isobutyl ketone, ethylene glycol butyl ether, butyl acetate, cyclohexanone, and methyl ethyl ketone in a mass ratio of 5:5:1:1:5:1.
[0048]The production process is as follows: soak the thermoplastic polyurethane resin in the diluent for 8 hours, then heat it in an infrared oven at 60°C for 0.5 hours, and then stir it on a high-speed disperser at a speed of 1000r / min for 0.5 hours to obtain a polyurethane solution; ( 2) Add hydroxyacrylic resin, MDI curing agent and additives to the aforementioned polyurethane solution, and continue to stir for 0.5h on a high-speed disperser at a speed of 1500r / min, and...
Embodiment 3
[0050] The formula of the adhesive S3 of the present embodiment is: Tg is 34% of thermoplastic polyurethane resin of 120 DEG C; 20% of hydroxyl acrylic resin (hydroxyl value 75 KOHmg / g); 5% of MDI curing agent; diameter of 15 μm) 8%; additives: defoamer 2% + leveling agent 1%; diluent 30%, the aforementioned content is the mass percentage.
[0051] Wherein, the diluent is a mixed system of xylene, methyl isobutyl ketone, ethylene glycol butyl ether, butyl acetate, cyclohexanone, and methyl ethyl ketone in a mass ratio of 5:5:1:1:5:1.
[0052] The production process is as follows: soak the thermoplastic polyurethane resin in the diluent for 8 hours, then heat it in an infrared oven at 60°C for 0.5 hours, and then stir it on a high-speed disperser at a speed of 1000r / min for 0.5 hours to obtain a polyurethane solution; ( 2) Add hydroxyacrylic resin, MDI curing agent and additives to the aforementioned polyurethane solution, and continue to stir for 0.5h on a high-speed disperser...
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