Halogen-free resin composition and application thereof

Abstract

The invention discloses a halogen-free resin composition which is prepared from the following components in parts by weight: 15 to 30 parts of epoxy resin with a large epoxy equivalent, 20 to 55 parts of epoxy resin with a small epoxy equivalent, 10 to 45 parts of a curing agent, and 0.03 to 2.0 parts of a curing accelerant, wherein the equivalent of the epoxy resin with the large epoxy equivalent is 300 to 800g/eq, and the equivalent of the epoxy resin with the small epoxy equivalent is 170 to 280g/eq; the degree of functionality of the epoxy resin is 2 to 4. The effect of improving the heat resistance and the wet resistance of a copper foil layer-covered pressing plate prepared by the composition disclosed by the invention is outstanding; the problems that a copper foil layer-covered pressing plate CEM-1 is easy to crack and layer under a high-temperature condition and easily absorbs water under a wet condition are solved; the reliability of the CEM-1 under the wet and hot environments is enhanced; furthermore, the halogen-free resin composition is halogen-free and environment-friendly.

Description

technical field [0001] The invention belongs to the technical field of copper-clad laminates, and in particular relates to a halogen-free resin composition. The invention also relates to a prepreg, a laminate and a printed circuit board made of the above-mentioned halogen-free resin composition. Background technique [0002] Common reinforcing materials for copper clad laminates are glass fiber cloth, glass fiber paper, and wood pulp paper. The pores of glass fiber cloth and glass fiber paper are larger than those of wood pulp paper, and resin can easily pass through the pores. The fiber is fully covered, so that the reinforcing effect of the fiber and the interlayer bonding performance can be fully exerted. However, the pores of wood pulp paper are mostly micron and nano-sized. Due to the large molecular weight of the resin, it is difficult to fully soak and cover the wood pulp paper fibers, which leads to the reinforcement effect and interlayer bonding of wood pulp paper. ...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a halogen-free resin composition, which solves the problem of foaming and delamination of CEM-1 core material under high temperature conditions due to the reinforcing effect of wood pulp paper fibers and poor interlayer adhesion. Cracking between layers, leading to bond failure and easy water absorption in wet conditions

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