Manufacturing method of single-face local thick-gold plated PCB
A local electroplating and production method technology, which is applied in the direction of multilayer circuit manufacturing, printed circuit manufacturing, electrical components, etc., can solve problems such as permeation plating or thin lines, and achieve the effect of improving product quality and yield
Inactive Publication Date: 2016-05-11
JIANGMEN SUNTAK CIRCUIT TECH
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Problems solved by technology
[0004] The present invention aims at the problem of bleed plating or line thinning that is easy to occur when partial thick gold plating on PCB in the prior art, and provides a method for manufacturing a single-sided partial thick gold plating PCB, which can avoid the occurrence of bleed plating and thin line problems
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Embodiment
[0017] This embodiment provides a method for manufacturing a thick gold PCB with partial electroplating on one side. The specifications and parameters of the prepared PCB backplane are as follows:
[0018]
[0019] Specific steps are as follows:
[0020] (1) multilayer board
[0021] According to the existing technology, the base material is made into a multi-layer board by successively going through material cutting→negative film process to make inner layer circuit→pressing→drilling→immersion copper→full board electroplating, that is, the inner core board, prepreg and outer layer The copper foil is pressed together and has been drilled, copper-immersed and plated on the whole board. details as follows:
[0022] a. Cutting: Cut out the core board according to the panel size 520mm×620mm, and the thickness of the core board is 1.1mmH / H.
[0023] b. Inner layer circuit (negative film process): produced by vertical coating machine, the film thickness is controlled to 8μm, a...
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Abstract
The invention relates to the technical field of circuit board production and specifically provides a manufacturing method of a single-face local thick-gold plated PCB. According to the invention, the required thicknesses of face copper and hole wall copper are reached by one time in a whole board plating processing, and an outer circuit is only manufactured on the upper surface of a multi-layer board requiring local thick-gold plating, the outer circuit is temporarily not manufactured on the lower surface of the multi-layer board, thus a large copper surface and metalized holes of the lower surface of the multi-layer board can be used as a conductive layer to carry out nickel-gold plating and thick-gold plating, and then a negative film process flow is utilized to manufacturing the outer circuit of the lower surface of the multi-layer board. By ingeniously changing the manufacturing sequence of the outer circuits and the locally-plated thick gold and utilizing the negative film process flow in a matched manner, the problems of diffusion coating and fine lines are avoided, so that the yield rate and the quality of the product are improved.
Description
technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for manufacturing a single-sided partial electroplated thick gold PCB. Background technique [0002] Electroplating thick gold on PCB can improve the conductivity, solderability and stability of PCB, etc. The existing methods for partial electroplating of thick gold on the PCB mainly include the positive film without lead process and the negative film with lead process. The lead-free process of the positive film is generally as follows: pre-process→sinking copper plate electrical→outer layer graphics 1 (making thick gold bit graphics)→graphic nickel gold→electrical thick gold→fading film 1→outer layer graphics 2 (making outer layer circuit graphics)→ Pattern electroplating → film fading 2 → outer layer etching → post-process, such as a method for making a leadless local hard gold-plated printed circuit board disclosed in Chinese patent application docum...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H05K3/18H05K3/46
CPCH05K3/188H05K3/46H05K2203/0723
Inventor 黄力胡志勇罗家伟王海燕
Owner JIANGMEN SUNTAK CIRCUIT TECH