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Hot melt adhesive

A hot-melt adhesive and polymer technology, applied in the direction of adhesive types, adhesives, conjugated diene adhesives, etc., can solve problems such as poor compatibility and poor thermal stability, and achieve improved compatibility. , the effect of reducing the content and high peel strength

Inactive Publication Date: 2016-06-01
HENKEL KGAA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, polylactic acid has a problem of being difficult to mix with polyolefin, and has poor compatibility with "tackifier resins", which are additives for hot melt adhesives and have poor thermal stability

Method used

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  • Hot melt adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0118] For the purpose of describing the present invention in a more detailed and specific manner, the present invention will be described through examples. These examples are for illustrative purposes only, and are not interpreted restrictively.

[0119] In the examples and comparative examples, the components mixed in the hot melt adhesive are shown below.

[0120]

[0121] (A1) SEBS modified with amino group ("DYNARON8630P", manufactured by JSRCorporation)

[0122] (A2) SEBS modified with maleic acid group ("TAFTECM1943", manufactured by AsahiKasei Chemicals Corporation)

[0123]

[0124] (B1) Poly-LD-lactic acid resin ("4060D", manufactured by NatureWorks, LLC)

[0125] (B2) Poly-L-lactic acid resin ("4032D", manufactured by NatureWorks, LLC)

[0126] (B3) Polybutylene succinate resin ("AD92W", manufactured by Mitsubishi Chemical Corporation)

[0127]

[0128] (C) Propylene / ethylene / 1-butene copolymer ("VESTPLAST703", manufactured by EVONIKDEGUSSA)

[0129] (C2) Propylene / ethylene / 1-b...

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Abstract

The present invention provides a hot melt adhesive which is excellent in environmental friendliness, thermal stability, adhesion to a polyolefin substrate and a polyester substrate, and heat resistance. The present invention relates to a hot melt adhesive comprising (A) a polar functional group-modified conjugated diene-based polymer, (B) an aliphatic polyester-based resin, (C) an amorphous olefin-based polymer, (D) a crystalline polypropylene resin, and (E) a tackifier resin.

Description

Technical field [0001] Based on the Paris Convention, this application claims the priority of Japanese Patent Application No. 2013-221628 (filed on October 24, 2013), and the entire content of the application is incorporated herein by reference. [0002] The present invention relates to hot-melt adhesives, and more particularly to hot-melt adhesives that exhibit good adhesion to substrates such as polyolefin and polyester substrates and are particularly suitable for use in automotive interior materials. Background technique [0003] Hot-melt adhesives are solvent-free adhesives, and since the adhesive is applied to the adherend after being heated and melted, and then solidified by cooling, it shows adhesiveness. The adhesive has the ability to instantly bond with Features of high-speed bonding. For example, hot melt adhesives are currently widely used in paper processing, woodworking, sanitary materials, electronics, and automotive interior materials. [0004] Patent Document 1 dis...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J167/04C09J157/02C09J145/00C09J123/14C09J153/02C09J123/12C09J11/08
CPCC09J11/08C09J145/00C09J157/02C09J167/04C08L2205/035C08L23/14C08L57/02C08L23/12C08L53/025C08L67/04C08L45/00C08L67/02C08L23/0815C09J109/00C09J153/005C09J153/025C09J123/08C08L23/08C09J7/241C09J7/255C08L91/00C08L2205/04C08L23/16C08L51/00C08L23/142B32B7/12B32B27/06B32B27/32B32B27/36B32B2250/02B32B2255/10B32B2255/26B32B2605/003C09J123/22C09J2423/00C09J2467/00
Inventor 竹中真早川正
Owner HENKEL KGAA