A kind of planting device and planting method of ccga device
A device and post-planting technology, which is applied in the field of post-planting technology of CCGA devices, can solve the problems affecting the quality of CCGA device products, low yield of CCGA devices, easy to scratch or bend solder posts, etc., to improve the post-planting finished products rate, reduce the probability of solder climbing, and reduce the effect of welding post damage
Active Publication Date: 2018-07-31
BEIJING MXTRONICS CORP +1
View PDF4 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0004] (1) The post-planting method of ceramic post-grid array device pads facing down increases the probability of solder climb, so that the CCGA devices after post-planting are easy to bridge, resulting in low yield of CCGA devices;
[0005] (2) When the pillar is planted, the welding pillar is placed on the CCGA device through the mesh formed by stacking multiple metal stencils. On the one hand, the cost is high, and the metal stencil has warpage and poor flatness. It is easy to scratch or bend the welding post during disassembly, which will damage the welding post and affect the verticality of the welding post, thereby affecting the quality of CCGA device products
On the other hand, the thermal conductivity of the device is low, and it is difficult to debug the reflow soldering process
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0027] Below in conjunction with accompanying drawing, the present invention will be described in further detail:
[0028] Such as figure 1 As shown, the device for planting columns of CCGA devices of the present invention includes a welding column carrier plate 1, a base 2, a positioning column 3 and a pressing block 4, and the base 2 is processed with grooves for placing CCGA devices, and the four corners of the grooves are enlarged It is arc-shaped, which is convenient for taking and placing CCGA devices. The depth of the groove is 0-0.5mm larger than the thickness of CCGA devices, which is convenient for providing space for solder joint formation; 1 is fixed above the base 2; a mesh hole is processed on the welding post carrier plate 1, and the diameter of the mesh hole is about 5% larger than that of the welding post, which ensures the verticality of the welding post and makes it easy to demould the CCGA device after reflow. The position corresponds to the pad of the CCG...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a column planting device and a column planting method of a CCGA (Ceramic Column Gate Array) device. The column planting device comprises a welding column carrier plate, a base, a pressure block and a positioning column. The column planting method comprises the following steps: placing the CCGA device into a groove of the base, aligning and fixing the welding column carrier plate and the base by utilizing the positioning column, placing the welding column successively into meshes of the welding column carrier plate, keeping the welding column upright on a bonding pad of the CCGA device, stabilizing the welding column by utilizing the pressure block, and implementing the column planting process by virtue of refluxing welding. By adopting the device and the method, the welding column can be welded onto the bonding pad of the CCGA device, so that a column planting finished product rate can reach more than 98 percent.
Description
technical field [0001] The invention relates to a column planting device and a column planting method of a CCGA device, belonging to the field of column planting technology of CCGA devices. Background technique [0002] With the rapid development of modern integrated circuit technology, the miniaturization, high speed and high reliability of integrated circuits require electronic components to be miniaturized and integrated, and at the same time, new packaging technologies are also emerging and developing. As the main packaging form of large-scale integrated circuits today, ball grid array packaging has been widely used in different fields. As a form of ball grid array packaging, ceramic ball grid array packaging has the advantages of high electrothermal performance, strong air tightness, good moisture resistance and high reliability. The ceramic column grid array package is the development and improvement of the ceramic ball grid array package. The column grid is used to r...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/60
CPCH01L24/11H01L24/742H01L2224/111H01L2224/742
Inventor 唐超赵元富姚全斌王勇练滨浩林鹏荣黄颖卓
Owner BEIJING MXTRONICS CORP