Nanometre spraying device and method thereof for realizing high-load CPU enhanced heat dissipation function

A spray device and high-load technology, which is applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of easy scaling or blockage, large pressure loss, and high requirements, so as to reduce demand, increase thermal conductivity, and ensure safety effect

Active Publication Date: 2016-06-22
泰州市海创新能源研究院有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, due to the small size of the microchannel, it is easy to foul or blo

Method used

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  • Nanometre spraying device and method thereof for realizing high-load CPU enhanced heat dissipation function
  • Nanometre spraying device and method thereof for realizing high-load CPU enhanced heat dissipation function
  • Nanometre spraying device and method thereof for realizing high-load CPU enhanced heat dissipation function

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Embodiment approach

[0038] figure 1 and figure 2Shown is an embodiment of the nano-spray device for realizing the high-load CPU enhanced heat dissipation function of the present invention, and the nano-spray device for realizing the high-load CPU enhanced heat dissipation function includes a PCB circuit board 1, a CPU 3, and a thin copper sheet 4 , condensation pipe 5, spray chamber 6, coolant tank 12, filter 13, coolant 14, effect mechanism and controller 24. By spraying the coolant mist onto the surface of the CPU3, film boiling heat transfer and forced convection heat transfer are formed to realize efficient heat dissipation of the CPU3.

[0039] The effect mechanism includes a nozzle 7, a micropump group 9, a radiator 16 and a semiconductor refrigerator 15;

[0040] The CPU3 is located on the PCB circuit board 1, and the upper surface of the CPU3 is closely attached to the thin copper sheet 4 through a layer of extremely thin and evenly thick high-temperature insulating heat-conducting glu...

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Abstract

The invention relates to a nanometre spraying device and method thereof for realizing a high-load CPU enhanced heat dissipation function, belonging to the field of research of internal combustion engines. The nanometre spraying device comprises a PCB, a CPU, a thin copper plate, a condenser pipe, a spraying cavity, a cooling liquid tank, a filter, cooling liquid, an effect mechanism and a controller; when a CPU thermistor on the PCB monitors that the temperature of the CPU is beyond a limit value, a nozzle is opened; cooling liquid fog droplets are sprayed on the thin copper plate on the surface of the CPU; heat on the surface of the CPU is taken away through film boiling heat exchange and forced-convection heat exchange; after being congealed on the condenser pipe, steam flows down along the wall surface and enters a radiator through a cooling liquid recovery hole, such that steam flows back into the cooling liquid tank; a more effective and energy-saving heat dissipation manner is provided for high-power equipment; the heat conductivity coefficient of the cooling liquid is increased by adding nano-particles into the cooling liquid; therefore, the heat dissipation efficiency of the device is further increased; all the adopted components are micro-equipment; the power consumption is low; but, the heat dissipation effect is high; therefore, a lot of electricity can be saved; and the nanometre spraying device and method disclosed by the invention have an important meaning in the energy-saving and environment-friendly aspects.

Description

technical field [0001] The invention belongs to the technical field of communication equipment, and in particular relates to a nano-spray device and a method thereof for realizing the enhanced heat dissipation function of a high-load CPU. Background technique [0002] Today's electronics industry is developing rapidly, electronic equipment is highly miniaturized and integrated, power density is getting higher and higher, local heat flux is increasing, and chip heat dissipation has become a bottleneck restricting its development. From electron tubes to transistors, during the sixty years of rapid technological development, the chip industry has undergone earth-shaking changes. Geelsinger, Intel's chief technology officer responsible for the internal design of the chip, once said: "If the chip's energy consumption and heat dissipation problems are not solved, by 2005 when 200 million transistors are integrated on the chip, it will be as hot as a nuclear reactor. .2010 will re...

Claims

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Application Information

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IPC IPC(8): H01L23/427H01L23/433H01L23/38
CPCH01L23/427H01L23/38H01L23/4336
Inventor 谭小强王谦姜鹏邵长胜韩丹
Owner 泰州市海创新能源研究院有限公司
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