A nano-spray device and method for realizing high-load cpu enhanced heat dissipation function

Abstract

The invention relates to a nanometre spraying device and method thereof for realizing a high-load CPU enhanced heat dissipation function, belonging to the field of research of internal combustion engines. The nanometre spraying device comprises a PCB, a CPU, a thin copper plate, a condenser pipe, a spraying cavity, a cooling liquid tank, a filter, cooling liquid, an effect mechanism and a controller; when a CPU thermistor on the PCB monitors that the temperature of the CPU is beyond a limit value, a nozzle is opened; cooling liquid fog droplets are sprayed on the thin copper plate on the surface of the CPU; heat on the surface of the CPU is taken away through film boiling heat exchange and forced-convection heat exchange; after being congealed on the condenser pipe, steam flows down along the wall surface and enters a radiator through a cooling liquid recovery hole, such that steam flows back into the cooling liquid tank; a more effective and energy-saving heat dissipation manner is provided for high-power equipment; the heat conductivity coefficient of the cooling liquid is increased by adding nano-particles into the cooling liquid; therefore, the heat dissipation efficiency of the device is further increased; all the adopted components are micro-equipment; the power consumption is low; but, the heat dissipation effect is high; therefore, a lot of electricity can be saved; and the nanometre spraying device and method disclosed by the invention have an important meaning in the energy-saving and environment-friendly aspects.

Description

technical field [0001] The invention belongs to the technical field of communication equipment, and in particular relates to a nano-spray device and a method thereof for realizing the enhanced heat dissipation function of a high-load CPU. Background technique [0002] Today's electronics industry is developing rapidly, electronic equipment is highly miniaturized and integrated, power density is getting higher and higher, local heat flux is increasing, and chip heat dissipation has become a bottleneck restricting its development. From electron tubes to transistors, during the sixty years of rapid technological development, the chip industry has undergone earth-shaking changes. Geelsinger, Intel's chief technology officer responsible for the internal design of the chip, once said: "If the chip's energy consumption and heat dissipation problems are not solved, by 2005 when 200 million transistors are integrated on the chip, it will be as hot as a nuclear reactor. .2010 will re...

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Problems solved by technology

However, due to the small size of the microchannel, it is easy to foul or block, and the pressure loss is large, so the requirements for the pump are high

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