A nano-spray device and method for realizing high-load cpu enhanced heat dissipation function
A spray device and high-load technology, which is applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve problems such as easy scaling or blockage, high requirements, and large pressure loss, so as to reduce demand, increase thermal conductivity, The effect of reducing pollution
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[0038] figure 1 and figure 2Shown is an embodiment of the nano-spray device for realizing the high-load CPU enhanced heat dissipation function of the present invention, and the nano-spray device for realizing the high-load CPU enhanced heat dissipation function includes a PCB circuit board 1, a CPU 3, and a thin copper sheet 4 , condensation pipe 5, spray chamber 6, coolant tank 12, filter 13, coolant 14, effect mechanism and controller 24. By spraying the coolant mist onto the surface of the CPU3, film boiling heat transfer and forced convection heat transfer are formed to realize efficient heat dissipation of the CPU3.
[0039] The effect mechanism includes a nozzle 7, a micropump group 9, a radiator 16 and a semiconductor refrigerator 15;
[0040] The CPU3 is located on the PCB circuit board 1, and the upper surface of the CPU3 is closely attached to the thin copper sheet 4 through a layer of extremely thin and evenly thick high-temperature insulating heat-conducting glu...
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