Preparation method of back junction N type solar battery, back junction N type solar battery, back junction N type solar battery assembly and back junction N type solar battery system
A solar cell, N-type technology, applied in the field of solar cells, can solve the problems of loss of open circuit voltage, high proportion of silver-containing paste, serious metal recombination, etc., to improve open circuit voltage, reduce silver paste consumption, and reduce production. cost effect
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Embodiment 1
[0031] see figure 1 , Figure 3 to Figure 9 As shown, the preparation method of the back-junction N-type solar cell in this embodiment includes the following steps:
[0032] (1), prepare the back-junction N-type solar cell before metallization, comprise N-type crystalline silicon substrate 10, the front surface of N-type crystalline silicon substrate 10 comprises the n+ doped region 12 and front surface passivation reduction successively from inside to outside The reverse film 14 ; the back surface of the N-type crystalline silicon substrate 10 includes a p+ doped region 16 and a passivation film 18 on the back surface sequentially from inside to outside. Wherein the passivation anti-reflection film 14 on the front surface is SiO 2 and SiN x A composite dielectric film composed of a dielectric film, the passivation film 18 on the back surface is SiO 2 、SiN x and Al 2 o 3 One or more of the dielectric films. The thickness of the N-type crystalline silicon substrate 10 i...
Embodiment 2
[0038] see Figure 1 to Figure 9 As shown, the preparation method of the back-junction N-type solar cell in this embodiment includes the following steps:
[0039] (1), prepare the back-junction N-type solar cell before metallization, comprise N-type crystalline silicon substrate 10, the front surface of N-type crystalline silicon substrate 10 comprises the n+ doped region 12 and front surface passivation reduction successively from inside to outside The reverse film 14 ; the back surface of the N-type crystalline silicon substrate 10 includes a p+ doped region 16 and a passivation film 18 on the back surface sequentially from inside to outside. Wherein the passivation anti-reflection film 14 on the front surface is SiO 2 and SiN x A composite dielectric film composed of a dielectric film, the passivation film 18 on the back surface is SiO 2 、SiN x and Al 2 o 3 One or more of the dielectric films. The thickness of the N-type crystalline silicon substrate 10 is 50-300 μm;...
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