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Compositions of resin-linear organosiloxane block copolymers

An organosiloxane, block copolymer technology, used in semiconductor/solid-state device parts, coatings, semiconductor devices, etc., can solve problems such as being not durable, difficult to apply, and unable to cure quickly enough

Active Publication Date: 2018-10-23
DOW SILICONES CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, many currently available coatings lack toughness; are not durable; are not durable; are not easy to apply; do not cure quickly enough for some applications; and in some cases produce undesirable by-products upon curing

Method used

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  • Compositions of resin-linear organosiloxane block copolymers
  • Compositions of resin-linear organosiloxane block copolymers
  • Compositions of resin-linear organosiloxane block copolymers

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0345] Example 1: Representative Preparation of Resin-Linear (RL) Block Copolymers

[0346] A 12 L three neck round bottom flask was charged with phenyl-T resin (1800 g, 13.18 mol Si, Dow Corning 217 flakes) and toluene (1482 g) under nitrogen. The flask was equipped with a thermometer, a Teflon stirring impeller, and a Dean-Stark apparatus (the Dean-Stark apparatus was preloaded with toluene) attached to a water-cooled condenser. The reaction mixture was heated at reflux for 30 minutes and 8.18 g of water were removed. The reaction solution was cooled to 108°C, and MTA / ETA (methyltriacetoxysilane / ethyltriacetoxysilane)-terminated silanol-terminated PhMe siloxane (synthesized by adding 50 / 50% by weight of MTA / ETA (methyltriacetoxysilane / ethyltriacetoxysilane) (46.96g, 0.207mol Si) was added to siloxane (2200g, 16.13mol Si, DP=127; where "DP " represents the degree of polymerization as determined by NMR) and they were stirred in a glove box at room temperature for 1 hour)....

example 2

[0347] Example 2: M with 3.5 mol% Vi Vi Preparation of Resin-Linear Block Copolymer

[0348] A 1 L dry three-neck round bottom flask was charged with the resin-linear block copolymer (100 g, 0.77 mol Si, 0.138 mol silanol) prepared according to Example 1 in toluene (150 g) and triethylamine (TEA, 5.76 mol) under nitrogen. mL, 0.0414mol) in solution, then stirred for 10 minutes. Vinyldimethylsilyl chloride (5.7 mL, 0.0414 mol) was slowly added to the flask via syringe over 10 minutes. A white salt precipitate formed within 1 minute after the addition of the chlorosilane. The reaction mixture was stirred under nitrogen at room temperature for 3 h, then 1 mL of deionized water was added to quench unreacted chlorosilane. Finally, 5 g of anhydrous Na 2 SO 4 Add to the flask, then stir overnight under air to dry the solution completely. The next day, the reaction solution was filtered with 1.2 μm filter paper at 20 psi to remove white salt precipitates. The solvent was comp...

example 3

[0349] Example 3: M with 2 mol% Vi Vi Preparation of Modified Resin-Linear Block Polymer

[0350] (i) M Vi 0.045 T Ph 0.955 Preparation of the resin: deionized water (1011.9 g) was charged into a 3L three-neck round bottom flask, and then cooled to 4° C. with an ice-water bath. The flask was equipped with a thermometer, a Teflon stirring impeller and a water-cooled condenser. A premixed solution of phenyltrichlorosilane (500.5 g, 2.366 mol), vinyldimethylchlorosilane (15.03 g, 0.125 mol) and toluene (494.4 g) was added to cold water over 2 minutes, followed by removal of the ice Stir for 5 minutes in a water bath (the maximum temperature of the solution during the reaction is at most 74° C.). The reaction mixture was transferred to a 2L round bottom flask fitted with a bottom drain valve, and the aqueous layer was removed. Deionized water (82.4 g) was added to the remaining material, which was then heated at 80° C. for 10 minutes, followed by cooling and removal of th...

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Abstract

The present disclosure provides hydrosilylation curable compositions comprising a resinous linear organosiloxane block copolymer comprising from about 0.5 to about 5 mole % of C1 to C30 hydrocarbyl groups containing at least one aliphatic unsaturated bond, and the like. Such hydrosilylation-curable resin-linear organosiloxane block copolymers have significantly faster cure rates than their condensation-curable counterparts. Faster curing speeds are important for packaging electronic devices, such as light emitting diode (LED) chip devices, especially devices with tall structures.

Description

[0001] Cross references to related patent applications [0002] This application claims the benefit of US Provisional Application Serial No. 61 / 879,447, filed September 18, 2013, which is incorporated by reference as if fully set forth herein. Background technique [0003] Many electronic devices use encapsulation coatings to protect electronic components from environmental elements. These protective coatings must be tough, durable, long-lasting, easy to apply and cure relatively quickly without producing undesirable by-products. However, many currently available coatings lack toughness; are not durable; are not durable; are not easy to apply; do not cure quickly enough for some applications; and in some cases produce undesirable by-products upon curing . Accordingly, there is a continuing need to identify protective and / or functional coatings in many emerging technical fields. Contents of the invention [0004] Example 1 relates to an organosiloxane block copolymer compr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09D183/10C09D183/14C08L83/10C08L83/14
CPCC09D183/10C09D183/14C08G77/20C08G77/50C08L83/10C08L83/14C08G77/80H01L33/501C08G77/44C08L83/00C08J5/18C08L2201/10H01L23/296C08L2203/206H01L33/507H01L33/56
Inventor J·B·霍斯特曼S·斯维尔魏彦虎
Owner DOW SILICONES CORP