Coplanarity measuring system based on ultrasonic grating

Abstract

The invention discloses a coplanarity measuring system based on an ultrasonic grating. The system comprises a laser source, a signal generator, a laser expanding system, an acousto-optic medium container, an ultrasonic transducer, a computer, a mobile platform, an optical platform and a CCD camera. The laser source, the signal generator, the laser expanding system, the acousto-optic medium container and the mobile platform are all installed on the optical platform. The laser source, the laser expanding system and the acousto-optic medium container are successively arranged on the optical platform from front to back. The ultrasonic transducer is arranged at the left side of the acousto-optic medium container. A reflecting surface is arranged on the right side of the acousto-optic medium container and is used for reflecting ultrasonic waves. The mobile platform is used for accommodating an object to be measured, and the surface, contacting the object to be measured, of the mobile platform serves as a reference surface. According to the invention, the ultrasonic grating technology is adopted, so that the measuring area, precision and speed are all improved, and the demands of high precision and rapid measurement are met.

Description

technical field [0001] The invention belongs to the field of measurement systems, and more specifically relates to a coplanarity measurement system. Background technique [0002] With the development of microelectronic packaging devices towards lighter, smaller, and higher integration, the mismatch of thermal expansion coefficients of various packaging materials in microelectronic devices will cause many reliability problems during the manufacture and use of microelectronic devices. Problems such as warpage of substrates. During the packaging process, the deformation and warpage of printed circuit boards (PCB substrates), ceramic substrates, silicon substrates, and metal substrates is one of the important factors affecting the quality, performance and reliability of microelectronic devices. Therefore, in order to improve the reliability and yield of microelectronic devices, the warpage measurement of the substrate of the device during the package manufacturing process is cr...

AI Technical Summary

Problems solved by technology

The physical scanning process of the laser beam results in very low measurement speeds

Moreover, the traditional detection method needs to achieve the phase shift of the reference grid through mechanical movement, the moving speed is slow, and there are certain requirements for the accuracy of the reference grid, and the vibration, noise and repetitive phase shift accuracy caused by the movement are not good, which cannot meet the requirements of high precision and fast detection. measurement requirements

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