A method of reducing the viscosity of sebs‑g‑mah solutions

Abstract

The invention discloses a method for reducing the solution viscosity of maleic anhydride grafted styrene-ethylene-butadiene-styrene copolymer (SEBS-g-MAH), which is characterized in that it comprises the following steps: 1) Vacuum drying SEBS- g-MAH; 2) Dissolve the SEBS-g-MAH in 1) with a solvent to obtain a SEBS-g-MAH solution; 3) Add a certain amount of viscosity-reducing additive to 2), and stir until it is evenly mixed. effectively reduce the solution viscosity; said step 2) the solid content of the SEBS-g-MAH solution is 15 to 30%; said step 3) said viscosity reducing aid can be dimethyl carbonate, ethyl acetate, butyl acetate, Isobutyl acetate, methyl methacrylate, isooctyl acrylate, absolute ethanol, diacetone alcohol, hydroxypropyl acrylate, butyl acrylate, or a mixture of two or more viscosity-reducing additives; Step 3) The maximum amount of the viscosity-reducing additive can account for 6-9% of the solution mass. The present invention finds an auxiliary agent for reducing the viscosity of SEBS-g-MAH solution, the addition amount is small, the method is simple and effective, and the problem of poor fluidity of solvent-based SEBS-g-MAH adhesive is solved, and it is a solvent-based SEBS-g-MAH adhesive. The application of g‑MAH adhesives provides the possibility of moisture-proof insulation protection materials for module devices.

Description

technical field [0001] The invention relates to the field of solvent-based adhesives, in particular to a method for reducing the solution viscosity of maleic anhydride grafted styrene-ethylene-butadiene-styrene copolymer (SEBS-g-MAH). Background technique [0002] SEBS-g-MAH is known as the fourth generation of rubber with safety and environmental protection performance. It has excellent properties such as weather resistance, heat resistance, compression deformation resistance and insulation. It is a multi-purpose thermoplastic elastomer. Its products are industrialized And industrial applications, market development, etc. have become important research hotspots. [0003] In the electrical industry, circuit protection in module devices usually requires a layer of encapsulation material that can protect against moisture and insulation. As a packaging material, it is generally required that the solid content of the solvent-based adhesive is 15-30% and the solution fluidity is...

AI Technical Summary

Problems solved by technology

If these three methods are used to prepare solvent-based SEBS-g-MAH adhesives, the mechanical properties of the adhesive will decrease after film formation and the service life will be shortened.