A stacked packaging structure and its manufacturing method

Abstract

The invention relates to a stacked packaging structure and process method thereof. The structure includes a first packaging body (1) and a second packaging body (2), the first packaging body (1) includes a first substrate (14) and a first chip (16), the first substrate (14) includes first copper cylinders (1), an upper surface of a first plastic packaging material (17) above the first substrate is provided with holes (18) in positions corresponding to the first copper cylinders (11), the tops of the first copper cylinders (11) are provided with solder balls (13), the second packaging body (2) includes a second substrate (19), a second chip (20) and a second plastic packaging material (21), second copper cylinders (13) are arranged on a lower surface of the second substrate (19), and the second copper cylinders (12) are inserted in the holes (18) on the first plastic packaging material (17). The stacked packaging structure and process method thereof enable the solder balls to avoid a bridge connection phenomenon during reflow soldering, so as to improve the yield of products.

Description

technical field [0001] The invention relates to a stacked packaging structure and a process method thereof, belonging to the technical field of semiconductor packaging. Background technique [0002] With the vigorous development of portable electronic products in recent years, all kinds of related products are gradually moving towards the trend of high density, high performance, light, thin, short and small, and various types of package stacking (package on package, PoP). Cooperate with innovation, in order to meet the requirements of thin, light, small and high density. [0003] Such as figure 1 As shown in , it is a schematic cross-sectional view of an existing POP packaging structure. The package stacking device includes two stacked package structures 100 and another package structure 200 . After the first package 100 is formed, the upper surface of the first package is thinned to expose the copper pillars 101 , and the second package 200 is stacked and electrically co...

AI Technical Summary

Problems solved by technology

[0005] 1. With the miniaturization of electronic components, the distance between the lines in the package becomes smaller, and the distance between the solder balls needs to be reduced, so that the adjacent solder balls are prone to bridging;

[0006] 2. The volume and height tolerance of the solder balls after reflow is large. During reflow, the solder balls will first become soft and collapsed. At the same time, after bearing the weight of the package body 200 above, they are easy to collapse and deform, and bridging occurs;

[0007] 3. The grid array formed by the solder balls is prone to poor coplanarity, resulting in unbalanced stress on the joints and easily causing the stack structure to tilt

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