Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A kind of epoxy resin matrix composite material and preparation method thereof

An epoxy resin matrix and epoxy resin technology, applied in the field of composite materials, can solve problems such as poor damping effect, poor strength and toughness, and achieve the effects of improving mechanical properties, simple steps and mild reaction conditions

Active Publication Date: 2018-06-12
HUAZHONG UNIV OF SCI & TECH
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] For the above defects or improvement needs of the prior art, the present invention provides an epoxy resin-based composite material and a preparation method thereof, the purpose of which is to add polystyrene hollow spheres and polyethylene glycol to the epoxy resin, thereby This solves the technical problems of poor strength and toughness and poor damping effect of existing epoxy resin-based composite materials

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of epoxy resin matrix composite material and preparation method thereof
  • A kind of epoxy resin matrix composite material and preparation method thereof
  • A kind of epoxy resin matrix composite material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0042] The preparation method of this epoxy resin-based composite material comprises the following steps:

[0043] (1) According to the volume ratio or mass ratio of polystyrene hollow spheres, polyethylene glycol and epoxy resin, polystyrene hollow spheres and polyethylene glycol are added to epoxy resin, at 40 ° C ~ 70 ° C, First use 600r / min-2000r / min high-speed mechanical stirring for 0.5h-2h to roughly disperse the polystyrene hollow spheres with low density in the epoxy resin, and then ultrasonically disperse them for 0.5h-2h to make the three evenly dispersed to obtain dispersion system; if direct ultrasound without mechanical stirring, polystyrene hollow spheres will float on the surface of epoxy resin in large quantities and it is difficult to mix;

[0044] (2) According to the mass ratio of curing agent, curing accelerator and epoxy resin, add curing agent and curing accelerator to the dispersion system obtained in step (1), first stir at 1200r / min~1600r / min for 2min~1...

Embodiment 1

[0049] An epoxy resin-based composite material, comprising polystyrene hollow spheres, polyethylene glycol and E-44 bisphenol A type epoxy resin, the polystyrene hollow spheres and polyethylene glycol are uniformly dispersed in epoxy resin Among them, the polystyrene hollow spheres are added in an amount of 4.0vol.% of the epoxy resin matrix, and the polyethylene glycol is added in an amount of 10.0wt.% of the epoxy resin. The polystyrene hollow spheres have an outer diameter ranging from 500nm to 600nm, a wall thickness ranging from 50nm to 100nm, and a density of about 0.13g / cm 3 , the surface of the polystyrene hollow spheres contains carboxyl groups, which are dispersed in ethanol, and the morphology is observed with a transmission electron microscope, the results are as follows figure 1 As shown; the polyethylene glycol is PEG-600; the epoxy resin matrix is ​​composed of epoxy resin, curing agent and curing accelerator, and the density is about 1.18g / cm 3 .

[0050] The...

Embodiment 2

[0057] An epoxy resin-based composite material, comprising polystyrene hollow spheres, polyethylene glycol and E-44 bisphenol A type epoxy resin, the polystyrene hollow spheres and polyethylene glycol are uniformly dispersed in epoxy resin Among them, the polystyrene hollow spheres are added in an amount of 8.0vol.% of the epoxy resin matrix, and the polyethylene glycol is added in an amount of 10.0wt.% of the epoxy resin matrix. The polystyrene hollow spheres have an outer diameter ranging from 500nm to 600nm, a wall thickness ranging from 50nm to 100nm, and a density of about 0.13g / cm 3 , the polystyrene hollow sphere surface contains carboxyl groups; the polyethylene glycol is PEG-600; the epoxy resin matrix is ​​composed of epoxy resin, curing agent and curing accelerator, and the density is about 1.18g / cm 3 . The preparation method of described epoxy resin-based composite material, comprises the following steps:

[0058] (1) Add 14.3 grams of polyethylene glycol and 1...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
diameteraaaaaaaaaa
thicknessaaaaaaaaaa
densityaaaaaaaaaa
Login to View More

Abstract

The invention discloses an epoxy resin matrix compositematerial and a preparation method thereof. The epoxy resin matrix compositematerial comprises an epoxy resin matrix as well as polystyrene hollow spheres and polyethylene glycolwhich are uniformly dispersed in the epoxy resin matrix, wherein the content of the polystyrene hollow spheres accounts for 4.0-32.0vol.% that of the epoxy resin matrix; the content of the polyethylene glycol accounts for 2.0-10.0wt% that of the epoxy resin matrix. The epoxy resin matrix compositematerial is good in mechanical property and sound insulation property, and moreover the preparationmethod of the epoxy resin matrix compositematerial is simple in step, gentle in reaction condition, applicable to large-scale industrial production and good in industrial prospect and application prospect.

Description

technical field [0001] The invention belongs to the field of composite materials, and more specifically relates to an epoxy resin-based composite material and a preparation method thereof. Background technique [0002] Epoxy resin is widely used in building materials, electrical materials, electronic packaging materials, adhesives and many other fields due to its excellent electrical insulation, mechanical and adhesive properties, and chemical corrosion resistance. However, epoxy resin does not have a damping function, and its cured product is brittle, poor impact resistance, easy to crack and other defects limit the high-end application of epoxy resin. Therefore, toughening modification and functionalization are the inevitable choices for epoxy resin modification; structural materials with high strength, toughness and high damping have become an urgent need in the fields of vibration reduction and noise reduction. [0003] Among them, the resin-based composite foam materia...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L25/06C08L71/08
CPCC08L63/00C08L2205/03C08L2205/20C08L25/06C08L71/00
Inventor 周兴平吕雄解孝林施雪军何承恩张平
Owner HUAZHONG UNIV OF SCI & TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com