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Method for producing ca-containing copper alloy

A manufacturing method, copper alloy technology, applied in the direction of chemical instruments and methods, metal layered products, metal material coating technology, etc., can solve the problems of floating matter, low Ca addition rate, easy oxidation of metal Ca, etc., to achieve inhibition Excellent effect of entrainment and surface quality

Active Publication Date: 2016-08-03
MITSUBISHI MATERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since metal Ca has a high vapor pressure, it becomes metal fume when it comes into contact with molten copper, and the addition rate of Ca is low, making it difficult to accurately adjust the Ca concentration of Ca-containing copper alloys.
In addition, since metal Ca is easily oxidized, there is a possibility that floating matter may be generated when casting a Ca-containing copper alloy, and the floating matter (Ca oxide) may be involved in the ingot.

Method used

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  • Method for producing ca-containing copper alloy
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  • Method for producing ca-containing copper alloy

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0070]Hereinafter, the result of the evaluation test which evaluated the manufacturing method of the Ca containing copper alloy of this invention is demonstrated.

[0071] (Copper-coated Ca material)

[0072] An oxygen-free copper wire φ3mm (with an oxygen content of 10 mass ppm or less) having an oxygen content of less than 100 mass ppm was prepared, and the surface of metal Ca was sprayed by arc spraying or flame spraying to produce a copper-coated Ca material. At this time, as metal Ca, bulk metal Ca having a particle size of 5 mm to 10 mm and rod-shaped metal Ca having a diameter of 10 mm×20 mm were prepared.

[0073] Metal Ca is uniformly arranged on the wire mesh, and copper is uniformly deposited on the metal Ca by vibrating the wire mesh. This operation was carried out at least once, and it was visually confirmed that the surface of the metal Ca was completely covered, and the thickness of the coated copper was about 1 mm.

example 1~4

[0075] 5 kg of electrolytic copper with a purity of 99.9% by mass or more was melted at 1150°C in a vacuum melting furnace, and the copper-melt solution kept in an Ar atmosphere using the above-mentioned copper-coated Ca material had a Ca concentration of the target concentration shown in Table 1. The method is added, and poured into an iron casting mold, thereby obtaining an ingot of 70mm×50mm×150mm.

Embodiment 2

[0093] Next, copper-clad Ca materials shown in Table 2 were prepared as follows.

[0094] Copper wires having an oxygen content of φ3mm shown in Table 2 were prepared, and the surface of metal Ca was sprayed by an arc spraying method or a flame spraying method. At this time, the metal Ca is uniformly arranged on the wire mesh, and the copper material is uniformly deposited on the metal Ca by vibrating the wire mesh. This operation was carried out at least once or more, and it was visually confirmed that the surface of the metal Ca was completely covered.

[0095] For the obtained copper-coated Ca material, calculate the volume V of the metal Ca Ca and the volume V of the clad copper Cu The volume ratio between V Cu / V Ca , and the weight W of metal Ca Ca and the weight of clad copper W Cu The weight ratio between W Cu / W Ca . The results are shown in Table 2.

[0096] In addition, using the copper-coated Ca material prepared as above, an ingot was produced in the sam...

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Abstract

A method for producing a Ca-containing copper alloy is characterized by involving a Ca addition step of adding Ca to a copper melt, wherein a copper-coated Ca material (20) in which the surface of metal Ca (21) is coated with copper (22) is used in the Ca addition step. It is preferred that, in the copper-coated Ca material (20), the oxygen content in the copper (22) with which the metal Ca (21) is coated is less than 100 ppm by mass.

Description

technical field [0001] The present invention relates to a method for producing a Ca-containing copper alloy including a Ca addition step of adding Ca to a copper melt. [0002] This application claims priority based on Patent Application No. 2013-260259 for which it applied in Japan on December 17, 2013, and uses the content here. Background technique [0003] Ca-containing copper alloys improve various properties by adding Ca, and are used as raw materials for various parts. [0004] For example, Patent Documents 1 to 3 propose sputtering targets made of a Ca-containing copper alloy. This sputtering target is used when forming the wiring film of the thin-film transistor (it abbreviates as "TFT" hereafter) used for flat-panel displays, such as a liquid crystal display and an organic EL display. [0005] More specifically, the flat panel display has a structure in which TFTs and display circuits are formed on a substrate made of glass, amorphous Si, silicon dioxide, or the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C1/02B22D1/00B22D11/00B22D11/108B22D11/11B22D21/00C23C14/34C22C9/00
CPCB22D1/00B22D11/00B22D11/108B22D11/11B22D21/00C22C9/00B22D11/004B22D11/116C23C14/14C23C14/3414B32B15/01B22D7/005B22D21/005H01J37/3429C22C1/02C22B9/103C22B15/006
Inventor 熊谷训园畠乔大户路晓
Owner MITSUBISHI MATERIALS CORP