Led substrate with electrical connection by bridging
A technology for electrical connections and substrates, applied in the field of modules and for assembling said supports, capable of solving problems such as limited positioning accuracy of diodes
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0041] said figure 1 with 2 A first embodiment of the invention is shown. figure 1 is a perspective view of the top surface of the support for light emitting diode type light sources. The support 2 mainly comprises a substrate 4 carrying light emitting diodes 12 . More specifically, the base plate, made of a thermally conductive material such as aluminium, comprises a thin and substantially flat first portion 8 and a second portion 6 forming cooling fins. The first and second parts are preferably integral, more preferably made from one piece of the same material. The fins 6 may extend in a direction substantially transverse, preferably perpendicular to the median plane of the first part.
[0042] The top surface 24 of the first part 8 carries two light-emitting diodes 12 . These are high power diodes, ie power greater than or equal to 3 watts, and the high power diodes can be fixed by their substrate. The diode comprises a substrate 20 made of ceramic material and an opt...
PUM
| Property | Measurement | Unit |
|---|---|---|
| diameter | aaaaa | aaaaa |
| length | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 