High-hardness high-conductivity cooper-carbon composite and preparation method and application thereof

A high-conductivity, composite material technology, applied in metal rolling, manufacturing tools, metal rolling, etc., can solve the problems of the volume fraction limit of the reinforcement, the inability to apply it on a large scale, and reduce the conductivity of copper. Low cost, increased hardness, and small reduction in electrical conductivity

Active Publication Date: 2016-08-24
WUHAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The conductivity of pure copper is very high, but the hardness is very low. In order to improve the hardness of copper, the method commonly used at present is through alloying, and alloying has inherent disadvantages: it significantly reduces the electrical conductivity of copper, such as the alloy developed in my country. Cu-1.0Ni-0.25Si-0.1Zn has a hardness of 160HV, but its electrical conductivity is only 61%IACS; Cu-0.15Fe-0.05P-0.1Zn has a hardness of 155HV, and its electrical conductivity is 75%IACS
However, when the in situ synthesis method is used, the volume fraction of the enhancer is limited
In addition, there are methods such as rapid solidification and spray molding. Although these methods can obtain metal matrix composites with uniform density and fine reinforcements, they are too economical to be applied on a large scale.

Method used

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  • High-hardness high-conductivity cooper-carbon composite and preparation method and application thereof
  • High-hardness high-conductivity cooper-carbon composite and preparation method and application thereof
  • High-hardness high-conductivity cooper-carbon composite and preparation method and application thereof

Examples

Experimental program
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Embodiment 1

[0035] In this embodiment, the grade of the copper plate is TU1, and its size is 100 mm in length, 10 mm in width, and 1 mm in thickness. The copper plate is heat-treated at 600°C in an argon protective atmosphere in advance, annealed after 2 hours, and the surface treatment such as deoxidizing film and degreasing is carried out on the fully annealed copper plate. The graphite powder is spread on the copper plate, and the graphite powder volume accounts for 0.1% of the volume of the whole composite material (copper+graphite). The graphite powder evenly covers the upper surface of half of the copper plate, and the copper plate is centered and bent to enclose the graphite powder. The folds are pressed and then rolled at room temperature without lubrication. Repeat the above procedure (surface treatment is carried out to the rolled copper plate, no longer add graphite powder, fold in half along the rolling direction, and then roll). The graphite powder has a purity of 99% and a ...

Embodiment 2

[0042]The graphite powder is sandwiched between pure copper copper plates that have been completely annealed, deoxidized, and degreased. The volume of the graphite powder accounts for 0.1% of the volume of the entire composite material (copper + graphite), and then it is used at room temperature without lubrication. The same process as in Example 1 was carried out continuously for 30 passes of cumulative rolling.

[0043] In this embodiment, the grade of the copper plate is TU1, and its size is 100 mm in length, 10 mm in width, and 1 mm in thickness. The copper plate is heat-treated at 600°C in an argon protective atmosphere in advance, annealed after 2 hours, and the surface treatment such as deoxidizing film and degreasing is carried out on the fully annealed copper plate. The purity of graphite powder is 99%, and the particle size is about 48 μm. Adopt industrial rolling mill, rolling speed is 187mm / min. During each rolling pass, the reduction in the thickness direction o...

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Abstract

The invention discloses a high-hardness high-conductivity cooper-carbon composite and a preparation method thereof. According to the method, graphite powder is evenly sandwiched between completely annealed and degreased pure copper plates of which oxidation films are removed, and then the copper plates are subjected to continuous accumulative rolling for many times. Under the action of rolling force, graphite particles are crushed and refined, layers in graphite are gradually separated, and a graphene structure having a remarkably strengthening effect is formed. With increase of rolling passes, carbon (including graphite and graphene) are not only dispersed in a surface parallel to the rolling direction along with lengthening of a sample in the rolling process, but also rapidly dispersed in the thickness direction of the sample. In the accumulative rolling process, copper base bodies generate a strain strengthening effect, so that the uniform high-hardness high-conductivity cooper-carbon composite is obtained finally. The composite has good hardness and comprehensive conductivity. The hardness of the composite can be 3.3 times that of pure copper, and the conductivity of the composite is higher than 90% IACS. The method is simple is preparation process, low in cost and beneficial to large-scale industrial application.

Description

technical field [0001] The invention relates to a copper-carbon composite material with high hardness and high conductivity, a preparation method and application thereof, and belongs to the field of composite materials. Background technique [0002] With the development of industry, many application fields, such as electrified locomotive contact wires, integrated circuit lead frames, electrical connectors, resistance welding electrodes, etc., require copper materials to maintain excellent electrical conductivity while also having high hardness and wear resistance performance. The conductivity of pure copper is very high, but the hardness is very low. In order to improve the hardness of copper, the method commonly used at present is through alloying, and alloying has inherent disadvantages: the electrical conductivity of copper is significantly reduced, such as the alloy developed in my country. Cu-1.0Ni-0.25Si-0.1Zn has a hardness of 160HV, but its conductivity is only 61%IA...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21B1/38B21B47/02B21B47/00
CPCB21B1/38B21B47/00B21B47/02B21B2001/386
Inventor 梅青松姚功铖李菊英李聪玲陈锋马烨张国栋杨兵
Owner WUHAN UNIV
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